Theipi ea boleng bo holimo ea 2021 Conductive Shielding - Filimi e Shielding ea EMI e nang le Tšireletso e Ntle - Lucky Innovative
Theipi ea boleng bo holimo ea 2021 Conductive Shielding - Filimi e Shielding ea EMI e nang le Tšireletso e Ntle - Lucky Innovative
Theipi ea 2021 ea boleng bo holimo ea Conductive Shielding - Filimi e Shielding ea EMI e nang le Tšireletso e Ntle - Lintlha tse ncha tsa Lehlohonolo:
Tlhaloso ea Sehlahisoa
EMI Shielding Film e sebelisoa haholo ho FPC e nang le li-Modules tsa mehala ea cellular, PC, lisebelisoa tsa bongaka, lik'hamera tsa dijithale, lisebelisoa tsa likoloi, jj.
Ho fumaneha ha Sehlahisoa
LKES-800
LKES-1000
LEKS-6000
Likarolo tsa Sehlahisoa
(1) Litšobotsi tse ntle tsa ho sebetsa
(2) Ts'ebetso e ntle ea motlakase
(3) Lintho tse ntle tsa tšireletso
(4) Ho hanyetsa mocheso o motle
(5) E na le botsoalle ba tikoloho (Halogen mahala, e fihlela litlhoko tsa RoHS Directives le REACH, joalo-joalo)
Sebopeho sa Sehlahisoa
Litšobotsi tsa Sehlahisoa
LKES -800
| Ntho | Lintlha tsa Tlhahlobo | Teko e tloaelehileng kapa mokhoa oa Teko |
| Botenya (Pele Lamination, μm) | 16±10% | Maemo a Khoebo |
| Botenya (Kamora Lamination, μm) | 13±10% | Maemo a Khoebo |
| Ho Khanyetso ha Lefatše(Khauta e pentiloeng, φ 1.0mm, 1.0cm, Ω) | JIS C5016 1994-7.1 | |
| Matla a ho ebola a filimi e matlafalitsoeng (N/25mm) | Maemo a Khoebo | |
| Phatlalatso ea Soldering e sa Lefeng Pele (MAX 265℃) | Ha ho stratification; Ha ho phophomang | JIS C6471 1995-9.3 |
| Solder (288 ℃, 10s, makhetlo a 3) | Ha ho stratification; Ha ho phophomang | JIS C6471 1995-9.3 |
| Shielding Properties(dB) | >50 | GB/T 30142-2013 |
| Ho hanyetsana le Bokaholimo (mΩ/ □) | 350 | Mekhoa e Mene ea Terminal |
| Lelakabe le Retardant | VTM-0 | UL94 |
| Sebopeho sa ho Hatisa | PHASA | JIS K5600 |
| Ho benya(60°, Gs) | ＜20 | GB9754-88 |
| Ho hanyetsa lik'hemik'hale (Acid, alkali le OSP) | PHASA | JIS C6471 1995-9.2 |
| Ho khomarela ho Stiffener (N/cm) | ＞4 | IPC-TM-650 2.4.9 |
LKES-1000
| Ntho | Lintlha tsa Tlhahlobo | Teko e tloaelehileng kapa mokhoa oa Teko |
| Botenya (Kamora Lamination, μm) | 14-18 | Maemo a Khoebo |
| Shielding Properties(dB) | ≥50 | GB/T 30142-2013 |
| Insulation ea holim'a metsi | ≥200 | Maemo a Khoebo |
| Adhesive Fastness (Teko ea lisele tse Lekholo) | Ha ho sele e oang | JIS C 6471 1995-8.1 |
| Ho hanyetsa Joala ho Hlakola | 50 Times ha ho na tšenyo | Maemo a Khoebo |
| Khanyetso ea Scratch | Ka makhetlo a 5 ha ho Leakage ea tšepe | Maemo a Khoebo |
| Ho hanyetsana le fatše, (Ho pola ka khauta, φ 1.0mm, 1.0cm, Ω) | ≤1.0 | JIS C5016 1994-7.1 |
| Phatlalatso ea Soldering e sa Lefeng Pele (MAX 265℃) | Ha ho stratification; Ha ho phophomang | JIS C6471 1995-9.3 |
| Solder (288 ℃, 10s, makhetlo a 3) | Ha ho stratification; Ha ho phophomang | JIS C6471 1995-9.3 |
| Sebopeho sa ho Hatisa | PHASA | JIS K5600 |
LKES-6000
| Ntho | Lintlha tsa Tlhahlobo | Teko e tloaelehileng kapa mokhoa oa Teko |
| Botenya (Kamora Lamination, μm) | 13±10% | Maemo a Khoebo |
| Shielding Properties(dB) | ≥50 | GB/T 30142-2013 |
| Ho Khanyetso ha Lefatše, (Khauta e pentiloeng, φ 1.0mm, 1.0cm, Ω) | ≤0.5 | JIS C5016 1994-7.1 |
| Ho Khanyetso ha Lefatše, (Khauta e pentiloeng, φ 1.0mm, 3.0cm, Ω) | 0.20 | JIS C5016 1994-7.1 |
| Matla a ho lokolla (N/cm) | Maemo a Khoebo | |
| Surface Insulation (mΩ) | ≥200 | Maemo a Khoebo |
| Adhesive Fastness(Teko ea lisele tse Lekholo) | Ha ho sele e oang | JIS C 6471 1995-8.1 |
| Phatlalatso ea Soldering e sa Lefeng Pele (MAX 265℃) | Ha ho stratification; Ha ho phophomang | JIS C6471 1995-9.3 |
| Solder (288 ℃, 10s, makhetlo a 3) | Ha ho stratification; Ha ho phophomang | JIS C6471 1995-9.3 |
| Lelakabe le Retardant | VTM-0 | UL94 |
| Sebopeho sa ho Hatisa | PHASA | JIS K5600 |
Recommended Processing Condition
| Mokhoa oa Lamination | Boemo ba lamination | Boemo ba ho tiisa | |||
| Mocheso (℃) | Khatello(kg) | Nako (s) | Mocheso (℃) | Nako(mets) | |
| Potlako- Lamination | LKES800/6000:180±10LKES1000:175±5 | 100-120 | 80-120 | 160±10 | 30-60 |
Tlhokomeliso: Moreki a ka fetola theknoloji ho latela maemo a nnete ha a sebetsa.
(1) Hlakola lera la tšireletso pele, ebe u tlama FPC, 80 ℃ Tafole ea ho futhumatsa e ka sebelisoa bakeng sa ho kopanya pele.
(2) Laminate ho ea ka ts'ebetso e ka holimo, tlosa, ebe u ebola filimi e tsamaisang ka mor'a ho pholile.
(3) Ts'ebetso ea ho tiisa.
Ho paka
(1) Tlhaloso e tloaelehileng ea sehlahisoa: 250mm×100m.
(2) Kamora ho tlosa motlakase o sa fetoheng, lihlahisoa li pakiloe ka pampiri ea foil ea aluminium hape li kenyelletsoa ho omisa ho eona.
(3) Ka ntle ho phuthetsoe ka mabokoseng a pampiri 'me ho tsitsitsoe ho netefatsa polokeho ea lihlahisoa nakong ea lipalangoang le ho sebetsana, le ho qoba tšenyo.
Polokelo le Tlhokomelo
(1) Boemo ba polokelo bo khothalelitsoeng
Mocheso: (0-10)℃; Mongobo: ka tlase ho 70% RH
(2) Tlhokomeliso
(2.1) Ka kopo u se ke ua bula sephutheloana se ka ntle 'me u leka-lekanya filimi e sireletsang mocheso oa kamore bakeng sa lihora tsa 6 pele u sebelisa ho fokotsa phello ea serame le phoka filiming e sireletsang.
(2.2) Etsa tlhahiso ea hore e sebelisoe kapele kamoo ho ka khonehang ka mor'a ho tsoa sebakeng se batang, haeba boleng bo fetoha tlas'a mocheso o tloaelehileng nako e telele.
(2.3) Sehlahisoa sena ha se hanyetsane le moemeli oa tiiso ea metsi le phallo, haeba u na le theknoloji e ka holimo ea ho sebetsa, ka kopo leka le ho netefatsa pele.
(2.4) Etsa tlhahiso ea ho lamination ka potlako, vacuum laminating e hloka ho hlahlojoa le ho netefatsoa.
(2.5) Nako ea netefatso ea boleng tlasa maemo a kaholimo ke likhoeli tse 6.
Litšoantšo tsa lintlha tsa sehlahisoa:
Tataiso e Amanang ea Sehlahisoa:
Liphehello tsa rona tsa ka ho sa feleng ke maikutlo a "mabaraka, ho nka moetlo, ho nka mahlale" hammoho le khopolo ea "boleng ba motheo, ho ba le tumelo ho ts'ebetso ea pele le tsamaiso e tsoetseng pele" bakeng sa 2021 ea boleng bo phahameng ba Conductive Shielding Tape - EMI Shielding Film with Good Shielding - Lucky Innovative , Sehlahisoa se tla fana ka thepa lefatšeng ka bophara, joalo ka Istanbul, Czechoslovakia le Istanbul. botšepehi ba ho phethahatsa litlhoko tsa bareki ba rona ba lefats'e ka boleng bo botle le boqapi ba boqapi. Re amohela bareki ka botlalo ho tsoa lefats'eng lohle ho theha likamano tse tsitsitseng le tse molemo tsa khoebo, ho ba le bokamoso bo khanyang hammoho.
Ka Molly ho tsoa Frankfurt - 2018.11.22 12:28 Khampani e na le botumo bo botle indastering ena, 'me qetellong ho ile ha fumaneha hore ho ba khetha ke khetho e ntle.
Ka Norma ho tsoa Mali - 2018.06.05 13:10 -
Filimi e Ncha ea ho Fihla Khatello ea China e Bontšang - P...
-
Filimi e rekisoang ea Machaena ea Magnetic Shielding - EM...
-
China Theko e tlase Prescale Film - Pressure Mea...
-
Hot sale Foil Shielding - EMI Shielding Film w...
-
China Theko e tlase Prescale Film - Pressure Mea...
-
Pampiri e Utloisisang Khatello e Phahameng - Pele...