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Theipi ea boleng bo holimo ea 2021 Conductive Shielding - Filimi e Shielding ea EMI e nang le Tšireletso e Ntle - Lucky Innovative

Theipi ea boleng bo holimo ea 2021 Conductive Shielding - Filimi e Shielding ea EMI e nang le Tšireletso e Ntle - Lucky Innovative

Tlhaloso e Khutšoanyane:


Lintlha tsa Sehlahisoa

Li-tag tsa Sehlahisoa

E Amanang le Video

Maikutlo (2)

Mokhatlo oa rona o tšepisa bareki bohle ka lihlahisoa le litharollo tsa boemo ba pele le tšebeletso e khotsofatsang ka ho fetisisa ea ka mor'a thekiso. Re amohela ka mofuthu bareki ba rona ba kamehla le ba bacha ho ikopanya le rona bakeng saLikarete tsa limpho tse se nang letho Magnetic Stripe,Pampiri ea Tekanyo ea Khatello,Filimi ea Phano ea Khatello, Re amohela ka tieo pals ho buisana le khoebo le ho qala tšebelisano. Re ts'epa ho kopanya matsoho le metsoalle liindastering tse fapaneng ho hlahisa bokamoso bo hlahelletseng bo lebelletsoeng.
Theipi ea 2021 ea boleng bo holimo ea Conductive Shielding - Filimi e Shielding ea EMI e nang le Tšireletso e Ntle - Lintlha tse ncha tsa Lehlohonolo:

Tlhaloso ea Sehlahisoa

EMI Shielding Film e sebelisoa haholo ho FPC e nang le li-Modules tsa mehala ea cellular, PC, lisebelisoa tsa bongaka, lik'hamera tsa dijithale, lisebelisoa tsa likoloi, jj.

Ho fumaneha ha Sehlahisoa

LKES-800
LKES-1000
LEKS-6000

Likarolo tsa Sehlahisoa

(1) Litšobotsi tse ntle tsa ho sebetsa
(2) Ts'ebetso e ntle ea motlakase
(3) Lintho tse ntle tsa tšireletso
(4) Ho hanyetsa mocheso o motle
(5) E na le botsoalle ba tikoloho (Halogen mahala, e fihlela litlhoko tsa RoHS Directives le REACH, joalo-joalo)

Sebopeho sa Sehlahisoa

Filimi e omileng

Litšobotsi tsa Sehlahisoa

LKES -800

Ntho Lintlha tsa Tlhahlobo Teko e tloaelehileng kapa mokhoa oa Teko
Botenya (Pele Lamination, μm) 16±10% Maemo a Khoebo
Botenya (Kamora Lamination, μm) 13±10% Maemo a Khoebo
Ho Khanyetso ha Lefatše(Khauta e pentiloeng, φ 1.0mm, 1.0cm, Ω) JIS C5016 1994-7.1
Matla a ho ebola a filimi e matlafalitsoeng (N/25mm) Maemo a Khoebo
Phatlalatso ea Soldering e sa Lefeng Pele (MAX 265℃) Ha ho stratification; Ha ho phophomang JIS C6471 1995-9.3
Solder (288 ℃, 10s, makhetlo a 3) Ha ho stratification; Ha ho phophomang JIS C6471 1995-9.3
Shielding Properties(dB) >50 GB/T 30142-2013
Ho hanyetsana le Bokaholimo (mΩ/ □) 350 Mekhoa e Mene ea Terminal
Lelakabe le Retardant VTM-0 UL94
Sebopeho sa ho Hatisa PHASA JIS K5600
Ho benya(60°, Gs) <20 GB9754-88
Ho hanyetsa lik'hemik'hale (Acid, alkali le OSP) PHASA JIS C6471 1995-9.2
Ho khomarela ho Stiffener (N/cm) >4 IPC-TM-650 2.4.9

LKES-1000

Ntho Lintlha tsa Tlhahlobo Teko e tloaelehileng kapa mokhoa oa Teko
Botenya (Kamora Lamination, μm) 14-18 Maemo a Khoebo
Shielding Properties(dB) ≥50 GB/T 30142-2013
Insulation ea holim'a metsi ≥200 Maemo a Khoebo
Adhesive Fastness (Teko ea lisele tse Lekholo) Ha ho sele e oang JIS C 6471 1995-8.1
Ho hanyetsa Joala ho Hlakola 50 Times ha ho na tšenyo Maemo a Khoebo
Khanyetso ea Scratch Ka makhetlo a 5 ha ho Leakage ea tšepe Maemo a Khoebo
Ho hanyetsana le fatše, (Ho pola ka khauta, φ 1.0mm, 1.0cm, Ω) ≤1.0 JIS C5016 1994-7.1
Phatlalatso ea Soldering e sa Lefeng Pele (MAX 265℃) Ha ho stratification; Ha ho phophomang JIS C6471 1995-9.3
Solder (288 ℃, 10s, makhetlo a 3) Ha ho stratification; Ha ho phophomang JIS C6471 1995-9.3
Sebopeho sa ho Hatisa PHASA JIS K5600

LKES-6000

Ntho Lintlha tsa Tlhahlobo Teko e tloaelehileng kapa mokhoa oa Teko
Botenya (Kamora Lamination, μm) 13±10% Maemo a Khoebo
Shielding Properties(dB) ≥50 GB/T 30142-2013
Ho Khanyetso ha Lefatše, (Khauta e pentiloeng, φ 1.0mm, 1.0cm, Ω) ≤0.5 JIS C5016 1994-7.1
Ho Khanyetso ha Lefatše, (Khauta e pentiloeng, φ 1.0mm, 3.0cm, Ω) 0.20 JIS C5016 1994-7.1
Matla a ho lokolla (N/cm) Maemo a Khoebo
Surface Insulation (mΩ) ≥200 Maemo a Khoebo
Adhesive Fastness(Teko ea lisele tse Lekholo) Ha ho sele e oang JIS C 6471 1995-8.1
Phatlalatso ea Soldering e sa Lefeng Pele (MAX 265℃) Ha ho stratification; Ha ho phophomang JIS C6471 1995-9.3
Solder (288 ℃, 10s, makhetlo a 3) Ha ho stratification; Ha ho phophomang JIS C6471 1995-9.3
Lelakabe le Retardant VTM-0 UL94
Sebopeho sa ho Hatisa PHASA JIS K5600

Recommended Processing Condition

Mokhoa oa Lamination Boemo ba lamination Boemo ba ho tiisa

Mocheso ()

Khatello(kg)

Nako (s)

Mocheso ()

Nako(mets)

Potlako- Lamination LKES800/6000:180±10LKES1000:175±5 100-120 80-120 160±10 30-60

Tlhokomeliso: Moreki a ka fetola theknoloji ho latela maemo a nnete ha a sebetsa.
(1) Hlakola lera la tšireletso pele, ebe u tlama FPC, 80 ℃ Tafole ea ho futhumatsa e ka sebelisoa bakeng sa ho kopanya pele.
(2) Laminate ho ea ka ts'ebetso e ka holimo, tlosa, ebe u ebola filimi ea sephethephethe ka mor'a ho pholile.
(3) Ts'ebetso ea ho tiisa.

Ho paka

(1) Tlhaloso e tloaelehileng ea sehlahisoa: 250mm×100m.
(2) Kamora ho tlosa motlakase o sa fetoheng, lihlahisoa li pakiloe ka pampiri ea foil ea aluminium hape li kenyelletsoa ho omisa ho eona.
(3) Ka ntle ho phuthetsoe ka mabokoseng a pampiri 'me ho tsitsitsoe ho netefatsa polokeho ea lihlahisoa nakong ea lipalangoang le ho sebetsana, le ho qoba tšenyo.

Polokelo le Tlhokomelo

(1) Boemo ba polokelo bo khothalelitsoeng
Mocheso: (0-10)℃; Mongobo: ka tlase ho 70% RH
(2) Tlhokomeliso
(2.1) Ka kopo u se ke ua bula sephutheloana se ka ntle 'me u leka-lekanya filimi e sireletsang mocheso oa kamore bakeng sa lihora tsa 6 pele u sebelisa ho fokotsa phello ea serame le phoka filiming e sireletsang.
(2.2) Etsa tlhahiso ea hore e sebelisoe kapele kamoo ho ka khonehang ka mor'a ho tsoa sebakeng se batang, haeba boleng bo fetoha tlas'a mocheso o tloaelehileng nako e telele.
(2.3) Sehlahisoa sena ha se hanyetsane le moemeli oa tiiso ea metsi le phallo, haeba u na le theknoloji e ka holimo ea ho sebetsa, ka kopo leka le ho netefatsa pele.
(2.4) Etsa tlhahiso ea ho lamination ka potlako, vacuum laminating e hloka ho hlahlojoa le ho netefatsoa.
(2.5) Nako ea netefatso ea boleng tlasa maemo a kaholimo ke likhoeli tse 6.


Litšoantšo tsa lintlha tsa sehlahisoa:

Theipi ea boleng bo holimo ea 2021 Conductive Shielding - Filimi e Shielding ea EMI e nang le Tšireletso e Ntle - Litšoantšo tsa Lehlohonolo la Innovative

Theipi ea boleng bo holimo ea 2021 Conductive Shielding - Filimi e Shielding ea EMI e nang le Tšireletso e Ntle - Litšoantšo tsa Lehlohonolo la Innovative

Theipi ea boleng bo holimo ea 2021 Conductive Shielding - Filimi e Shielding ea EMI e nang le Tšireletso e Ntle - Litšoantšo tsa Lehlohonolo la Innovative

Theipi ea boleng bo holimo ea 2021 Conductive Shielding - Filimi e Shielding ea EMI e nang le Tšireletso e Ntle - Litšoantšo tsa Lehlohonolo la Innovative

Theipi ea boleng bo holimo ea 2021 Conductive Shielding - Filimi e Shielding ea EMI e nang le Tšireletso e Ntle - Litšoantšo tsa Lehlohonolo la Innovative

Theipi ea boleng bo holimo ea 2021 Conductive Shielding - Filimi e Shielding ea EMI e nang le Tšireletso e Ntle - Litšoantšo tsa Lehlohonolo la Innovative


Tataiso e Amanang ea Sehlahisoa:

"Botšepehi, Boqapi, Bokhabane, le Ts'ebetso" ke mohopolo o phehellang oa k'hamphani ea rona bakeng sa nako e telele ea ho nts'etsapele mmoho le bareki bakeng sa poelano e tšoanang le melemo e kopaneng bakeng sa 2021 ea boleng bo phahameng ba Conductive Shielding Tape - EMI Shielding Film with Good Shielding - Lucky Innovative , Sehlahisoa se tla fana ka villa ea rona lefatšeng ka bophara, Bahamas, Vancouver "litheko tse utloahalang, nako e sebetsang ea tlhahiso le tšebeletso e ntle ka mor'a thekiso" e le molao oa rona. Re tšepa ho sebelisana le bareki ba bangata bakeng sa nts'etsopele le melemo e kopanetsoeng. Re amohela bareki ba ka bang teng ho ikopanya le rona.
  • Re k'hamphani e nyane e sa tsoa qala, empa re fumana tlhokomelo ea moetapele oa k'hamphani mme a re fa thuso e ngata. Re tšepa hore re ka hatela pele hammoho!
    5 LinaleliKa Victoria ho tsoa Kenya - 2017.03.07 13:42
    Moetsi enoa a ka tsoela pele ho ntlafatsa le ho phethahatsa lihlahisoa le tšebeletso, e lumellana le melao ea tlhōlisano ea 'maraka, k'hamphani ea tlhōlisano.
    5 LinaleliKa Wendy ho tsoa The Swiss - 2017.12.02 14:11
    Ngola molaetsa wa hao mona mme o re romele wona