Theipi ea boleng bo holimo ea 2021 Conductive Shielding - Filimi e Shielding ea EMI e nang le Tšireletso e Ntle

Theipi ea 2021 ea boleng bo holimo ea Conductive Shielding - Filimi e Shielding ea EMI e nang le Tšireletso e Ntle - Sets'oants'o sa Lucky Innovative Featured

Theipi ea boleng bo holimo ea 2021 Conductive Shielding - Filimi e Shielding ea EMI e nang le Tšireletso e Ntle - Lucky Innovative

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Lihlahisoa tsa rona le litharollo li tsejoa haholo ebile lia tšepahala ke bareki 'me li ka phethahatsa litlhoko tsa kamehla tsa lichelete le tsa sechaba bakeng saFilimi ea Tšireletso ea Plastiki ea Ka hare ea Koloi,Magnetic Stripe Card,Filimi ea Magnetic Shielding, Khotsofalo ea bareki ke sepheo sa rona se seholo. Re u amohela ho theha kamano ea khoebo le rona. Bakeng sa lintlha tse ling, ka kopo u se ke oa qeaqea ho ikopanya le rona.

Theipi ea 2021 ea boleng bo holimo ea Conductive Shielding - Filimi e Shielding ea EMI e nang le Tšireletso e Ntle - Lintlha tse ncha tsa Lehlohonolo:

Tlhaloso ea Sehlahisoa

EMI Shielding Film e sebelisoa haholo ho FPC e nang le li-Modules tsa mehala ea cellular, PC, lisebelisoa tsa bongaka, lik'hamera tsa dijithale, lisebelisoa tsa likoloi, jj.

Ho fumaneha ha Sehlahisoa

LKES-800
LKES-1000
LEKS-6000

Likarolo tsa Sehlahisoa

(1) Litšobotsi tse ntle tsa ho sebetsa
(2) Ts'ebetso e ntle ea motlakase
(3) Lintho tse ntle tsa tšireletso
(4) Ho hanyetsa mocheso o motle
(5) E na le botsoalle ba tikoloho (Halogen mahala, e fihlela litlhoko tsa RoHS Directives le REACH, joalo-joalo)

Sebopeho sa Sehlahisoa

Filimi e omileng

Litšobotsi tsa Sehlahisoa

LKES -800

Ntho	Lintlha tsa Tlhahlobo	Teko e tloaelehileng kapa mokhoa oa Teko
Botenya (Pele Lamination, μm)	16±10%	Maemo a Khoebo
Botenya (Kamora Lamination, μm)	13±10%	Maemo a Khoebo
Ho Khanyetso ha Lefatše(Khauta e pentiloeng, φ 1.0mm, 1.0cm, Ω)		JIS C5016 1994-7.1
Matla a ho ebola a filimi e matlafalitsoeng (N/25mm)		Maemo a Khoebo
Phatlalatso ea Soldering e sa Lefeng Pele (MAX 265℃)	Ha ho stratification; Ha ho phophomang	JIS C6471 1995-9.3
Solder (288 ℃, 10s, makhetlo a 3)	Ha ho stratification; Ha ho phophomang	JIS C6471 1995-9.3
Shielding Properties(dB)	>50	GB/T 30142-2013
Ho hanyetsana le Bokaholimo (mΩ/ □)	350	Mekhoa e Mene ea Terminal
Lelakabe le Retardant	VTM-0	UL94
Sebopeho sa ho Hatisa	PHASA	JIS K5600
Ho benya(60°, Gs)	＜20	GB9754-88
Ho hanyetsa lik'hemik'hale (Acid, alkali le OSP)	PHASA	JIS C6471 1995-9.2
Ho khomarela ho Stiffener (N/cm)	＞4	IPC-TM-650 2.4.9

LKES-1000

Ntho	Lintlha tsa Tlhahlobo	Teko e tloaelehileng kapa mokhoa oa Teko
Botenya (Kamora Lamination, μm)	14-18	Maemo a Khoebo
Shielding Properties(dB)	≥50	GB/T 30142-2013
Insulation ea holim'a metsi	≥200	Maemo a Khoebo
Adhesive Fastness (Teko ea lisele tse Lekholo)	Ha ho sele e oang	JIS C 6471 1995-8.1
Ho hanyetsa Joala ho Hlakola	50 Times ha ho na tšenyo	Maemo a Khoebo
Khanyetso ea Scratch	Ka makhetlo a 5 ha ho Leakage ea tšepe	Maemo a Khoebo
Ho hanyetsana le fatše, (Ho pola ka khauta, φ 1.0mm, 1.0cm, Ω)	≤1.0	JIS C5016 1994-7.1
Phatlalatso ea Soldering e sa Lefeng Pele (MAX 265℃)	Ha ho stratification; Ha ho phophomang	JIS C6471 1995-9.3
Solder (288 ℃, 10s, makhetlo a 3)	Ha ho stratification; Ha ho phophomang	JIS C6471 1995-9.3
Sebopeho sa ho Hatisa	PHASA	JIS K5600

LKES-6000

Ntho	Lintlha tsa Tlhahlobo	Teko e tloaelehileng kapa mokhoa oa Teko
Botenya (Kamora Lamination, μm)	13±10%	Maemo a Khoebo
Shielding Properties(dB)	≥50	GB/T 30142-2013
Ho Khanyetso ha Lefatše, (Khauta e pentiloeng, φ 1.0mm, 1.0cm, Ω)	≤0.5	JIS C5016 1994-7.1
Ho Khanyetso ha Lefatše, (Khauta e pentiloeng, φ 1.0mm, 3.0cm, Ω)	0.20	JIS C5016 1994-7.1
Matla a ho lokolla (N/cm)		Maemo a Khoebo
Surface Insulation (mΩ)	≥200	Maemo a Khoebo
Adhesive Fastness(Teko ea lisele tse Lekholo)	Ha ho sele e oang	JIS C 6471 1995-8.1
Phatlalatso ea Soldering e sa Lefeng Pele (MAX 265℃)	Ha ho stratification; Ha ho phophomang	JIS C6471 1995-9.3
Solder (288 ℃, 10s, makhetlo a 3)	Ha ho stratification; Ha ho phophomang	JIS C6471 1995-9.3
Lelakabe le Retardant	VTM-0	UL94
Sebopeho sa ho Hatisa	PHASA	JIS K5600

Recommended Processing Condition

Mokhoa oa Lamination	Boemo ba lamination			Boemo ba ho tiisa
Mokhoa oa Lamination	Mocheso (℃)	Khatello(kg)	Nako (s)	Mocheso (℃)	Nako(mets)
Potlako- Lamination	LKES800/6000:180±10LKES1000:175±5	100-120	80-120	160±10	30-60

Tlhokomeliso: Moreki a ka fetola theknoloji ho latela maemo a nnete ha a sebetsa.
(1) Hlakola lera la tšireletso pele, ebe u tlama FPC, 80 ℃ Tafole ea ho futhumatsa e ka sebelisoa bakeng sa ho kopanya pele.
(2) Laminate ho ea ka ts'ebetso e ka holimo, tlosa, ebe u ebola filimi ea sephethephethe ka mor'a ho pholile.
(3) Ts'ebetso ea ho tiisa.

Ho paka

(1) Tlhaloso e tloaelehileng ea sehlahisoa: 250mm×100m.
(2) Kamora ho tlosa motlakase o sa fetoheng, lihlahisoa li pakiloe ka pampiri ea foil ea aluminium hape li kenyelletsoa ho omisa ho eona.
(3) Ka ntle ho phuthetsoe ka mabokoseng a pampiri 'me ho tsitsitsoe ho netefatsa polokeho ea lihlahisoa nakong ea lipalangoang le ho sebetsana, le ho qoba tšenyo.

Polokelo le Tlhokomelo

(1) Boemo ba polokelo bo khothalelitsoeng
Mocheso: (0-10)℃; Mongobo: ka tlase ho 70% RH
(2) Tlhokomeliso
(2.1) Ka kopo u se ke ua bula sephutheloana se ka ntle 'me u leka-lekanya filimi e sireletsang mocheso oa kamore bakeng sa lihora tsa 6 pele u sebelisa ho fokotsa phello ea serame le phoka filiming e sireletsang.
(2.2) Etsa tlhahiso ea hore e sebelisoe kapele kamoo ho ka khonehang ka mor'a ho tsoa sebakeng se batang, haeba boleng bo fetoha tlas'a mocheso o tloaelehileng nako e telele.
(2.3) Sehlahisoa sena ha se hanyetsane le moemeli oa tiiso ea metsi le phallo, haeba u na le theknoloji e ka holimo ea ho sebetsa, ka kopo leka le ho netefatsa pele.
(2.4) Etsa tlhahiso ea ho lamination ka potlako, vacuum laminating e hloka ho hlahlojoa le ho netefatsoa.
(2.5) Nako ea netefatso ea boleng tlasa maemo a kaholimo ke likhoeli tse 6.

Litšoantšo tsa lintlha tsa sehlahisoa:

Tataiso e Amanang ea Sehlahisoa:

Boleng bo tšepahalang le boemo bo botle ba mokoloto ke melao-motheo ea rona, e tla re thusa maemong a holimo. Ho latela molao-motheo oa "boleng pele, moreki ea phahameng" bakeng sa 2021 High Conductive Shielding Tape - EMI Shielding Film with Good Shielding - Lucky Innovative , Sehlahisoa se tla fana ka lefats'e ka bophara, joalo ka: San Francisco, Norwegian, Algeria, Ho fihlela hajoale thepa ea rona e se e rometsoe kantle ho naha ho ea Bochabela bo Hare, Amerika Boroa, jj. 13years e nang le boiphihlelo ba ho rekisa le ho reka likarolo tsa Isuzu lapeng le kantle ho naha le beng ba lisebelisoa tsa morao-rao tsa lisebelisoa tsa elektroniki tsa Isuzu. Re hlompha mosuoe-hlooho oa rona oa Botšepehi khoebong, ntho e tlang pele tšebeletsong 'me re tla etsa sohle se matleng a rona ho fa bareki ba rona lintho tsa boleng bo holimo le tšebeletso e babatsehang.

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Motsamaisi oa k'hamphani o na le boiphihlelo bo matla haholo ba taolo le maikutlo a tiileng, basebetsi ba thekiso ba mofuthu ebile ba thabile, basebetsi ba tekheniki ke profeshenale ebile ba na le boikarabelo, kahoo ha re tšoenyehe ka sehlahisoa, moetsi ea motle.
5 Linaleli

Ka Marco ho tsoa Czech - 2018.06.19 10:42

Khamphani e boloka mohopolo oa ts'ebetso "tsamaiso ea mahlale, boleng bo holimo le boleng bo botle, moreki ea phahameng", re 'nile ra boloka tšebelisano-'moho khoebong. Sebetsa le uena, re ikutloa re le bonolo!
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Ka Lilith oa Indonesia - 2018.06.03 10:17

Ngola molaetsa wa hao mona mme o re romele wona