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Theipi ea boleng bo holimo ea 2021 Conductive Shielding - Filimi e Shielding ea EMI e nang le Tšireletso e Ntle - Lucky Innovative

Theipi ea boleng bo holimo ea 2021 Conductive Shielding - Filimi e Shielding ea EMI e nang le Tšireletso e Ntle - Lucky Innovative

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Maikutlo (2)

"E ipapisitse le 'maraka oa lehae le ho atolosa khoebo ea mose ho maoatle" ke leano la rona la nts'etsopele eaMof. Card,Theipi ea Conductive Shielding,Dry Film Hanyetsa, Re amohela ka tieo barekisi ba malapeng le ba mose ho maoatle ba founelang, mangolo a botsang, kapa limela ho buisana, re tla u hlahisa thepa ea boleng bo botle hammoho le thuso e matla ka ho fetisisa,Re sheba pele ka tlhahlobo ea hau le tšebelisano ea hau.
Theipi ea 2021 ea boleng bo holimo ea Conductive Shielding - Filimi e Shielding ea EMI e nang le Tšireletso e Ntle - Lintlha tse ncha tsa Lehlohonolo:

Tlhaloso ea Sehlahisoa

EMI Shielding Film e sebelisoa haholo ho FPC e nang le li-Modules tsa mehala ea cellular, PC, lisebelisoa tsa bongaka, lik'hamera tsa dijithale, lisebelisoa tsa likoloi, jj.

Ho fumaneha ha Sehlahisoa

LKES-800
LKES-1000
LEKS-6000

Likarolo tsa Sehlahisoa

(1) Litšobotsi tse ntle tsa ho sebetsa
(2) Ts'ebetso e ntle ea motlakase
(3) Lintho tse ntle tsa tšireletso
(4) Ho hanyetsa mocheso o motle
(5) E na le botsoalle ba tikoloho (Halogen mahala, e fihlela litlhoko tsa RoHS Directives le REACH, joalo-joalo)

Sebopeho sa Sehlahisoa

Filimi e omileng

Litšobotsi tsa Sehlahisoa

LKES -800

Ntho Lintlha tsa Tlhahlobo Teko e tloaelehileng kapa mokhoa oa Teko
Botenya (Pele Lamination, μm) 16±10% Maemo a Khoebo
Botenya (Kamora Lamination, μm) 13±10% Maemo a Khoebo
Ho Khanyetso ha Lefatše(Khauta e pentiloeng, φ 1.0mm, 1.0cm, Ω) JIS C5016 1994-7.1
Matla a ho ebola a filimi e matlafalitsoeng (N/25mm) Maemo a Khoebo
Phatlalatso ea Soldering e sa Lefeng Pele (MAX 265℃) Ha ho stratification; Ha ho phophomang JIS C6471 1995-9.3
Solder (288 ℃, 10s, makhetlo a 3) Ha ho stratification; Ha ho phophomang JIS C6471 1995-9.3
Shielding Properties(dB) >50 GB/T 30142-2013
Ho hanyetsana le Bokaholimo (mΩ/ □) 350 Mekhoa e Mene ea Terminal
Lelakabe le Retardant VTM-0 UL94
Sebopeho sa ho Hatisa PHASA JIS K5600
Ho benya(60°, Gs) <20 GB9754-88
Ho hanyetsa lik'hemik'hale (Acid, alkali le OSP) PHASA JIS C6471 1995-9.2
Ho khomarela ho Stiffener (N/cm) >4 IPC-TM-650 2.4.9

LKES-1000

Ntho Lintlha tsa Tlhahlobo Teko e tloaelehileng kapa mokhoa oa Teko
Botenya (Kamora Lamination, μm) 14-18 Maemo a Khoebo
Shielding Properties(dB) ≥50 GB/T 30142-2013
Insulation ea holim'a metsi ≥200 Maemo a Khoebo
Adhesive Fastness (Teko ea lisele tse Lekholo) Ha ho sele e oang JIS C 6471 1995-8.1
Ho hanyetsa Joala ho Hlakola 50 Times ha ho na tšenyo Maemo a Khoebo
Khanyetso ea Scratch Ka makhetlo a 5 ha ho Leakage ea tšepe Maemo a Khoebo
Ho hanyetsana le fatše, (Ho pola ka khauta, φ 1.0mm, 1.0cm, Ω) ≤1.0 JIS C5016 1994-7.1
Phatlalatso ea Soldering e sa Lefeng Pele (MAX 265℃) Ha ho stratification; Ha ho phophomang JIS C6471 1995-9.3
Solder (288 ℃, 10s, makhetlo a 3) Ha ho stratification; Ha ho phophomang JIS C6471 1995-9.3
Sebopeho sa ho Hatisa PHASA JIS K5600

LKES-6000

Ntho Lintlha tsa Tlhahlobo Teko e tloaelehileng kapa mokhoa oa Teko
Botenya (Kamora Lamination, μm) 13±10% Maemo a Khoebo
Shielding Properties(dB) ≥50 GB/T 30142-2013
Ho Khanyetso ha Lefatše, (Khauta e pentiloeng, φ 1.0mm, 1.0cm, Ω) ≤0.5 JIS C5016 1994-7.1
Ho Khanyetso ha Lefatše, (Khauta e pentiloeng, φ 1.0mm, 3.0cm, Ω) 0.20 JIS C5016 1994-7.1
Matla a ho lokolla (N/cm) Maemo a Khoebo
Surface Insulation (mΩ) ≥200 Maemo a Khoebo
Adhesive Fastness(Teko ea lisele tse Lekholo) Ha ho sele e oang JIS C 6471 1995-8.1
Phatlalatso ea Soldering e sa Lefeng Pele (MAX 265℃) Ha ho stratification; Ha ho phophomang JIS C6471 1995-9.3
Solder (288 ℃, 10s, makhetlo a 3) Ha ho stratification; Ha ho phophomang JIS C6471 1995-9.3
Lelakabe le Retardant VTM-0 UL94
Sebopeho sa ho Hatisa PHASA JIS K5600

Recommended Processing Condition

Mokhoa oa Lamination Boemo ba lamination Boemo ba ho tiisa

Mocheso ()

Khatello(kg)

Nako (s)

Mocheso ()

Nako(mets)

Potlako- Lamination LKES800/6000:180±10LKES1000:175±5 100-120 80-120 160±10 30-60

Tlhokomeliso: Moreki a ka fetola theknoloji ho latela maemo a nnete ha a sebetsa.
(1) Hlakola lera la tšireletso pele, ebe u tlama FPC, 80 ℃ Tafole ea ho futhumatsa e ka sebelisoa bakeng sa ho kopanya pele.
(2) Laminate ho ea ka ts'ebetso e ka holimo, tlosa, ebe u ebola filimi e tsamaisang ka mor'a ho pholile.
(3) Ts'ebetso ea ho tiisa.

Ho paka

(1) Tlhaloso e tloaelehileng ea sehlahisoa: 250mm×100m.
(2) Kamora ho tlosa motlakase o sa fetoheng, lihlahisoa li pakiloe ka pampiri ea foil ea aluminium hape li kenyelletsoa ho omisa ho eona.
(3) Ka ntle ho phuthetsoe ka mabokoseng a pampiri 'me ho tsitsitsoe ho netefatsa polokeho ea lihlahisoa nakong ea lipalangoang le ho sebetsana, le ho qoba tšenyo.

Polokelo le Tlhokomelo

(1) Boemo ba polokelo bo khothalelitsoeng
Mocheso: (0-10)℃; Mongobo: ka tlase ho 70% RH
(2) Tlhokomeliso
(2.1) Ka kopo u se ke ua bula sephutheloana se ka ntle 'me u leka-lekanya filimi e sireletsang mocheso oa kamore bakeng sa lihora tsa 6 pele u sebelisa ho fokotsa phello ea serame le phoka filiming e sireletsang.
(2.2) Etsa tlhahiso ea hore e sebelisoe kapele kamoo ho ka khonehang ka mor'a ho tsoa sebakeng se batang, haeba boleng bo fetoha tlas'a mocheso o tloaelehileng nako e telele.
(2.3) Sehlahisoa sena ha se hanyetsane le moemeli oa tiiso ea metsi le phallo, haeba u na le theknoloji e ka holimo ea ho sebetsa, ka kopo leka le ho netefatsa pele.
(2.4) Etsa tlhahiso ea ho lamination ka potlako, vacuum laminating e hloka ho hlahlojoa le ho netefatsoa.
(2.5) Nako ea netefatso ea boleng tlasa maemo a kaholimo ke likhoeli tse 6.


Litšoantšo tsa lintlha tsa sehlahisoa:

Theipi ea boleng bo holimo ea 2021 Conductive Shielding - Filimi e Shielding ea EMI e nang le Tšireletso e Ntle - Litšoantšo tsa Lehlohonolo la Innovative

Theipi ea boleng bo holimo ea 2021 Conductive Shielding - Filimi e Shielding ea EMI e nang le Tšireletso e Ntle - Litšoantšo tsa Lehlohonolo la Innovative

Theipi ea boleng bo holimo ea 2021 Conductive Shielding - Filimi e Shielding ea EMI e nang le Tšireletso e Ntle - Litšoantšo tsa Lehlohonolo la Innovative

Theipi ea boleng bo holimo ea 2021 Conductive Shielding - Filimi e Shielding ea EMI e nang le Tšireletso e Ntle - Litšoantšo tsa Lehlohonolo la Innovative

Theipi ea boleng bo holimo ea 2021 Conductive Shielding - Filimi e Shielding ea EMI e nang le Tšireletso e Ntle - Litšoantšo tsa Lehlohonolo la Innovative

Theipi ea boleng bo holimo ea 2021 Conductive Shielding - Filimi e Shielding ea EMI e nang le Tšireletso e Ntle - Litšoantšo tsa Lehlohonolo la Innovative


Tataiso e Amanang ea Sehlahisoa:

Ho khona ho u fa molemo le ho holisa khoebo ea rona, re boetse re na le bahlahlobi ho QC Team mme re u tiisetsa ts'ebeletso le lihlahisoa tsa rona tse kholo ka ho fetisisa bakeng sa 2021 High Quality Conductive Shielding Tape - EMI Shielding Film with Good Shielding - Lucky Innovative , Sehlahisoa se tla fana ka lefats'e ka bophara, joalo ka: Poland, Swaziland, Mumbai, boleng bo botle ba lihlahisoa tsa rona, ka lebaka la theko e ntle ho feta boleng ba lihlahisoa tsa rona. Linaha tse 10 le libaka. Re labalabela ho sebelisana le bareki bohle ba tsoang lapeng le kantle ho naha. Ho feta moo, khotsofalo ea bareki ke sepheo sa rona sa ka ho sa feleng.
  • Ena ke khoebo ea pele ka mor'a hore k'hamphani ea rona e thehe, lihlahisoa le lits'ebeletso li khotsofatsa haholo, re na le qalo e ntle, re tšepa ho sebelisana ka ho tsoelang pele nakong e tlang!
    5 LinaleliKa Judith ho tsoa Pakistan - 2018.09.19 18:37
    Maikutlo a basebetsi ba litšebeletso tsa bareki a tšepahala haholo 'me karabo e nakong ebile e na le lintlha tse ngata, sena se thusa haholo khoebong ea rona, kea leboha.
    5 LinaleliKa Honey ho tloha Panama - 2018.11.28 16:25
    Ngola molaetsa wa hao mona mme o re romele wona