Theipi ea boleng bo holimo ea 2021 Conductive Shielding - Filimi e Shielding ea EMI e nang le Tšireletso e Ntle

Theipi ea 2021 ea boleng bo holimo ea Conductive Shielding - Filimi e Shielding ea EMI e nang le Tšireletso e Ntle - Sets'oants'o sa Lucky Innovative Featured

Theipi ea boleng bo holimo ea 2021 Conductive Shielding - Filimi e Shielding ea EMI e nang le Tšireletso e Ntle - Lucky Innovative

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Khotsofalo ea bareki ke sepheo sa rona sa mantlha. Re tšehetsa boemo bo tsitsitseng ba botsebi, boleng, botšepehi le tšebeletso bakeng saFilimi e ka Hare,Hot Stamping Magnetic Stripe,Copper Film Emi Shielding, Re lula re amohela bareki ba bacha le ba khale ba re fa likeletso tsa bohlokoa le litlhahiso tsa tšebelisano, re ke re hole le ho nts'etsapele hammoho, le ho kenya letsoho sechabeng le basebetsi ba rona!

Theipi ea 2021 ea boleng bo holimo ea Conductive Shielding - Filimi e Shielding ea EMI e nang le Tšireletso e Ntle - Lintlha tse ncha tsa Lehlohonolo:

Tlhaloso ea Sehlahisoa

EMI Shielding Film e sebelisoa haholo ho FPC e nang le li-Modules tsa mehala ea cellular, PC, lisebelisoa tsa bongaka, lik'hamera tsa dijithale, lisebelisoa tsa likoloi, jj.

Ho fumaneha ha Sehlahisoa

LKES-800
LKES-1000
LEKS-6000

Likarolo tsa Sehlahisoa

(1) Litšobotsi tse ntle tsa ho sebetsa
(2) Ts'ebetso e ntle ea motlakase
(3) Lintho tse ntle tsa tšireletso
(4) Ho hanyetsa mocheso o motle
(5) E na le botsoalle ba tikoloho (Halogen mahala, e fihlela litlhoko tsa RoHS Directives le REACH, joalo-joalo)

Sebopeho sa Sehlahisoa

Filimi e omileng

Litšobotsi tsa Sehlahisoa

LKES -800

Ntho	Lintlha tsa Tlhahlobo	Teko e tloaelehileng kapa mokhoa oa Teko
Botenya (Pele Lamination, μm)	16±10%	Maemo a Khoebo
Botenya (Kamora Lamination, μm)	13±10%	Maemo a Khoebo
Ho Khanyetso ha Lefatše(Khauta e pentiloeng, φ 1.0mm, 1.0cm, Ω)		JIS C5016 1994-7.1
Matla a ho ebola a filimi e matlafalitsoeng (N/25mm)		Maemo a Khoebo
Phatlalatso ea Soldering e sa Lefeng Pele (MAX 265℃)	Ha ho stratification; Ha ho phophomang	JIS C6471 1995-9.3
Solder (288 ℃, 10s, makhetlo a 3)	Ha ho stratification; Ha ho phophomang	JIS C6471 1995-9.3
Shielding Properties(dB)	>50	GB/T 30142-2013
Ho hanyetsana le Bokaholimo (mΩ/ □)	350	Mekhoa e Mene ea Terminal
Lelakabe le Retardant	VTM-0	UL94
Sebopeho sa ho Hatisa	PHASA	JIS K5600
Ho benya(60°, Gs)	＜20	GB9754-88
Ho hanyetsa lik'hemik'hale (Acid, alkali le OSP)	PHASA	JIS C6471 1995-9.2
Ho khomarela ho Stiffener (N/cm)	＞4	IPC-TM-650 2.4.9

LKES-1000

Ntho	Lintlha tsa Tlhahlobo	Teko e tloaelehileng kapa mokhoa oa Teko
Botenya (Kamora Lamination, μm)	14-18	Maemo a Khoebo
Shielding Properties(dB)	≥50	GB/T 30142-2013
Insulation ea holim'a metsi	≥200	Maemo a Khoebo
Adhesive Fastness (Teko ea lisele tse Lekholo)	Ha ho sele e oang	JIS C 6471 1995-8.1
Ho hanyetsa Joala ho Hlakola	50 Times ha ho na tšenyo	Maemo a Khoebo
Khanyetso ea Scratch	Ka makhetlo a 5 ha ho Leakage ea tšepe	Maemo a Khoebo
Ho hanyetsana le fatše, (Ho pola ka khauta, φ 1.0mm, 1.0cm, Ω)	≤1.0	JIS C5016 1994-7.1
Phatlalatso ea Soldering e sa Lefeng Pele (MAX 265℃)	Ha ho stratification; Ha ho phophomang	JIS C6471 1995-9.3
Solder (288 ℃, 10s, makhetlo a 3)	Ha ho stratification; Ha ho phophomang	JIS C6471 1995-9.3
Sebopeho sa ho Hatisa	PHASA	JIS K5600

LKES-6000

Ntho	Lintlha tsa Tlhahlobo	Teko e tloaelehileng kapa mokhoa oa Teko
Botenya (Kamora Lamination, μm)	13±10%	Maemo a Khoebo
Shielding Properties(dB)	≥50	GB/T 30142-2013
Ho Khanyetso ha Lefatše, (Khauta e pentiloeng, φ 1.0mm, 1.0cm, Ω)	≤0.5	JIS C5016 1994-7.1
Ho Khanyetso ha Lefatše, (Khauta e pentiloeng, φ 1.0mm, 3.0cm, Ω)	0.20	JIS C5016 1994-7.1
Matla a ho lokolla (N/cm)		Maemo a Khoebo
Surface Insulation (mΩ)	≥200	Maemo a Khoebo
Adhesive Fastness(Teko ea lisele tse Lekholo)	Ha ho sele e oang	JIS C 6471 1995-8.1
Phatlalatso ea Soldering e sa Lefeng Pele (MAX 265℃)	Ha ho stratification; Ha ho phophomang	JIS C6471 1995-9.3
Solder (288 ℃, 10s, makhetlo a 3)	Ha ho stratification; Ha ho phophomang	JIS C6471 1995-9.3
Lelakabe le Retardant	VTM-0	UL94
Sebopeho sa ho Hatisa	PHASA	JIS K5600

Recommended Processing Condition

Mokhoa oa Lamination	Boemo ba lamination			Boemo ba ho tiisa
Mokhoa oa Lamination	Mocheso (℃)	Khatello(kg)	Nako (s)	Mocheso (℃)	Nako(mets)
Potlako- Lamination	LKES800/6000:180±10LKES1000:175±5	100-120	80-120	160±10	30-60

Tlhokomeliso: Moreki a ka fetola theknoloji ho latela maemo a nnete ha a sebetsa.
(1) Hlakola lera la tšireletso pele, ebe u tlama FPC, 80 ℃ Tafole ea ho futhumatsa e ka sebelisoa bakeng sa ho kopanya pele.
(2) Laminate ho ea ka ts'ebetso e ka holimo, tlosa, ebe u ebola filimi e tsamaisang ka mor'a ho pholile.
(3) Ts'ebetso ea ho tiisa.

Ho paka

(1) Tlhaloso e tloaelehileng ea sehlahisoa: 250mm×100m.
(2) Kamora ho tlosa motlakase o sa fetoheng, lihlahisoa li pakiloe ka pampiri ea foil ea aluminium hape li kenyelletsoa ho omisa ho eona.
(3) Ka ntle ho phuthetsoe ka mabokoseng a pampiri 'me ho tsitsitsoe ho netefatsa polokeho ea lihlahisoa nakong ea lipalangoang le ho sebetsana, le ho qoba tšenyo.

Polokelo le Tlhokomelo

(1) Boemo ba polokelo bo khothalelitsoeng
Mocheso: (0-10)℃; Mongobo: ka tlase ho 70% RH
(2) Tlhokomeliso
(2.1) Ka kopo u se ke ua bula sephutheloana se ka ntle 'me u leka-lekanya filimi e sireletsang mocheso oa kamore bakeng sa lihora tsa 6 pele u sebelisa ho fokotsa phello ea serame le phoka filiming e sireletsang.
(2.2) Etsa tlhahiso ea hore e sebelisoe kapele kamoo ho ka khonehang ka mor'a ho tsoa sebakeng se batang, haeba boleng bo fetoha tlas'a mocheso o tloaelehileng nako e telele.
(2.3) Sehlahisoa sena ha se hanyetsane le moemeli oa tiiso ea metsi le phallo, haeba u na le theknoloji e ka holimo ea ho sebetsa, ka kopo leka le ho netefatsa pele.
(2.4) Etsa tlhahiso ea ho lamination ka potlako, vacuum laminating e hloka ho hlahlojoa le ho netefatsoa.
(2.5) Nako ea netefatso ea boleng tlasa maemo a kaholimo ke likhoeli tse 6.

Litšoantšo tsa lintlha tsa sehlahisoa:

Tataiso e Amanang ea Sehlahisoa:

Lihlahisoa tsa rona li tsebahala haholo ebile li tšeptjoa ke basebelisi 'me li ka kopana le litlhoko tse tsoelang pele tsa moruo le tsa sechaba bakeng sa 2021 High Quality Conductive Shielding Tape - EMI Shielding Film with Good Shielding - Lucky Innovative , Sehlahisoa se tla fana ka lefats'e ka bophara, joalo ka: Algeria, Liverpool, Bolivia, Hona joale re na le sehlopha se hloahloa se fanang ka lits'ebeletso tsa boleng bo holimo, ho fana ka litšebeletso tsa boleng bo holimo, ho potlakisa ho fana ka litšebeletso ho bareki ba rona, ho fana ka litheko tse ntle ka nako. Khotsofalo le mokitlane o motle ho moreki e mong le e mong ke tsona tse tlang pele bophelong ba rona. Re 'nile ra lebella ka tieo ho sebelisana le bareki lefatšeng ka bophara. Re lumela hore re ka khotsofala le uena. Re boetse re amohela bareki ka mofuthu ho etela k'hamphani ea rona le ho reka tharollo ea rona.

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