2021 HD Dry Film Resist ea boleng bo holimo - Filimi e omileng e sebelisitsoeng ho FPC le PCB - Lucky Innovative
2021 HD Dry Film Resist ea boleng bo holimo - Filimi e omileng e sebelisitsoeng ho FPC le PCB - Lucky Innovative
2021 ea boleng bo holimo ea Dry Film Resist - Filimi e Omileng e Kentsoe ho FPC le PCB - Lehlohonolo la Innovative Detail:
Sesebelisoa sa Sehlahisoa
E sebelisoa ho Printed Circuit Board le Flexible Printed Circuit Board, ka monyetla oa ts'ebetso e ntle haholo ea ho hlokomela, ho rarolla le ho khomarela.
Sebopeho sa Sehlahisoa
Tlhaloso ea Sehlahisoa
| Khoutu ea Sehlahisoa | Filimi e omileng ea LK-D1238 LDI | Filimi e omileng ea LK-G1038 |
| Botenya (μm) | 38.0±2.0 | |
| Bolelele (m) | 200ｍ | |
| Bophara | Ho latela kopo ea bareki | |
Lihlahisoa tsa lihlahisoa
(1) LK-D1238 LDI Dry Film
LK-D1238 LDI Dry Film e loketse mochine oa ho hlahisa litšoantšo ka ho toba, o nang le bolelele ba 355nm le 405nm.
| Ntho le Mokhoa oa Teko | Lintlha tsa Tlhahlobo | |||
| Nako e khuts'oane ea ho nka setšoantšo (1.0wt.% Na2CO3 tharollo ea metsi, 30 ℃) *2 | 25s | |||
| Wavelength (nm) | 355 | 405 | ||
| Tshebetso ka mora ho Imaging | Photosensitivity (*2×2.0) | ST=7/21 Matla a pepeneneng*3 | 20mJ/cm2 | 15mJ/cm2 |
| Qeto(*2×2.0) | ST=6/21 | 40μm | 40μm | |
| ST=7/21 | 40μm | 40μm | ||
| ST=8/21 | 50μm | 50μm | ||
| Ho khomarela(*2×2.0) | ST=6/21 | 50μm | 50μm | |
| ST=7/21 | 40μm | 40μm | ||
| ST=8/21 | 35μm | 35μm | ||
| 【Tending Reliability】*3 10 masoba (6mmφ) Sekhahla sa ho phunyeha ha lesoba (*2×2.0×3 linako) | ST=6/21 | 0% | 0% | |
| ST=7/21 | 0% | 0% | ||
| ST=8/21 | 0% | 0% | ||
| Ho qeta nako ea ho qetela (3.0wt.%NaOH tharollo ea metsi, 50℃) | ST=7/21* 1 Matla a pepeneneng | 50s | 50s | |
(2) LK-G1038 Filimi e omileng
LK-G1038 Dry Film e loketse ho kopana le mochine oa ho pepeseha, o nang le maqhubu a maholo a 365nm.
| Ntho le Mokhoa oa Teko | Lintlha tsa Tlhahlobo | ||
| Nako e khuts'oane ea ho nka setšoantšo (1.0wt.% Na2CO3 tharollo ea metsi, 30 ℃) *2 | 22s | ||
| Tshebetso ka mora ho Imaging | Photosensitivity (*2×2.0) | ST=8/21 Matla a pepeneneng*3 | 90mJ/cm2 |
| Qeto (*2×2.0) | ST=6/21 | 32.5μm | |
| ST=7/21*1 | 32.5μm | ||
| ST=8/21 | 35μm | ||
| Ho khomarela (*2×2.0) | ST=6/21 | 45μm | |
| ST=7/21 | 40μm | ||
| ST=8/21 | 35μm | ||
| (Tending Reliability)*3 10 masoba (6mmφ) Sekhahla sa ho phunyeha ha lesoba (*2×2.0×3 linako) | ST=6/21 | 0% | |
| ST=7/21 | 0% | ||
| ST=8/21 | 0% | ||
| Ho qeta nako ea ho qetela (3.0wt.%NaOHwater tharollo, 50℃) | ST=7/21*1 Matla a pepeneneng | 50s | |
(Lintlha tse ka holimo ke tsa litšupiso feela)
Hlokomela:
*1: Stouffer 21 Stage Exposure Energy Scale.
* 2 × 2.0: Setšoantšo se nang le nako e habeli ea nako e khuts'oane ea ho nka litšoantšo.
*3: Haeba u tsepamisitse maikutlo ho Tending Reliability, ho khothaletsoa ho sebelisa boleng ba ho pepeseha ba 7 ~ 8 sethaleng.
*4: Lintlha tse ka holimo li lekoa ke lisebelisoa le lisebelisoa tsa rona.
Mokhoa oa kopo
Tlhokomeliso Ho Kopo
(1) Kopo : Sebelisa filimi ena feela e le ho hanyetsa bakeng sa boitsebiso bo amanang le boto ea potoloho le mekhoa e meng ea mohlala.
(2) Pretreatment : Mesaletsa ea lintho tse phelang, matheba ka lebaka la ho se be le metsi a lekaneng le ho omisa holim'a koporo, ho ka etsa hore polymerization ea ho hanyetsa le ho kenella ha tharollo ea ho pata kapa ea etching.Ka kopo omisa ka ho feletseng ka mor'a ho hlatsoa metsi. Haholo-holo, ha mongobo o ntse o le ka har'a lesoba, o etsa hore tente e robehe.
(3) Substrate preheating : Preheating ka mocheso o phahameng haholo ka nako e telele ho ka baka mafome.E lokela ho etsoa ka tlase ho metsotso e 10 ho 80 ℃ le ka tlase ho 3 min ho 150 ℃. 'Me ha mocheso oa holim'a substrate pele ho lamination o feta 70 ℃, botenya ba filimi ka lehlakoreng la lesoba le ka ba le tšesaane haholo' me le ka baka ho robeha ha tente.
(4) Ho tšoara ka mor'a lamination le ho pepeseha : Tšoara ka thebe e khanyang kapa tlas'a lebone le mosehla (limithara tse 2 kapa sebaka se fetang se hlokahalang). Nako e kholo ea ho tšoara tabeng ea ho qetela (tlas'a lebone le mosehla) ke matsatsi a 4. Ho pepeseha ho lokela ho etsoa ka hare ho matsatsi a 4 ka mor'a ho lamination. Ntlafatso e lokela ho etsoa ka hare ho matsatsi a 3 ka mor'a ho pepeseha. Lehlaseli la lebone le lesoeu le se nang ultraviolet le na le mahlaseli a mang a ultraviolet, kahoo tšoara ka thebe e khanyang ka lakane e ntšo tlas'a eona.Boloka mocheso oa 23±2℃ le mongobo o lekanyelitsoeng 60±10%RH. Li-substrates tsa laminated li lokela ho kenngoa ka rack ka bonngoe.
(5) Nts'etsopele: Ha mocheso oa moqapi o feta 35 ℃, o ka etsa hore profil ea ho hanyetsa e mpe le ho feta.
(6) Ho hlobola : Ho hlobola ka hare ho beke ka mor'a ho lamination.
(7) Phekolo ea litšila : Likarolo tse omileng tsa filimi ho moqapi le stripper li ka kopanngoa ke ho se nke lehlakore. Likarolo tse kopantsoeng li ka aroloa ho tsoa ho tharollo ea metsi ka mokhoa oa khatiso oa filthara le mokhoa oa centrifugal. Tharollo e arohaneng ea metsi e na le litekanyetso tse itseng tsa COD le BOD, kahoo e tlameha ho tšoaroa ka mokhoa o nepahetseng oa ho lahla litšila.
(8) Mmala wa filimi : Mmala o motala/putswa. Le hoja 'mala o ka fetoha butle-butle ha nako e ntse e ea, ha oa lokela ho susumetsa tšobotsi.
Tlhokomeliso On Storage
(1) Ha polokelo e etsoa sebakeng se lefifi, se phodileng, se omileng mocheso oa 5℃20℃ le mongobo o lekanyelitsoeng oa 60% RH kapa ka tlase, filimi e omileng e lokela ho sebelisoa matsatsing a 50 ka mor'a ho etsoa.
(2) Boloka lirolo tsa lifilimi ka mokhoa o otlolohileng ka ho sebelisa liraka kapa liboto tsa tšehetso bakeng sa polokelo. Ha li behiloe ka holimo, lipampiri tsa filimi e ommeng li ka thella ka bonngoe, 'me sebopeho sa moqolo se ka tšoana le lehlomela la bamboo (meqolo e beoa fatše ka har'a sephutheloana).
(3) Ntša lirolo tsa filimi ho tloha lakane e ntšo ka tlas'a lebone le mosehla kapa mofuta o tšoanang oa lebone la tšireletso. U se ke ua li tlohela ka tlas'a lebone le mosehla ka nako e telele. Koahela li-roll tsa filimi ka letlapa le letšo ha u li boloka nako e telele.
Litšoantšo tsa lintlha tsa sehlahisoa:
Tataiso e Amanang ea Sehlahisoa:
Re tla etsa boiteko bo bong le bo bong le ho sebetsa ka thata hore re be se setle le se setle haholo, 'me re potlakise mehato ea rona bakeng sa ho ema ka har'a boemo ba likhoebo tsa maemo a holimo le tsa theknoloji e phahameng bakeng sa 2021 High Quality Dry Film Resist - Dry Film Applied On FPC And PCB - Lucky Innovative , Sehlahisoa se tla fana ka thepa lefatšeng ka bophara, joalo ka: Nairobi, United Kingdom, belarus '. Romania hammoho le ho itokisetsa ho phunya thepa ea boleng bo holimo e hokahantsoeng le khatiso ea tshirt e le hore u ka khona Romania. Batho ba bangata ba lumela ka tieo hore re na le bokhoni bohle ba ho u fa litharollo tse monate.
Ka Judy ho tloha Cyprus - 2017.11.01 17:04 Ts'ebetso e phahameng ea tlhahiso le boleng bo botle ba sehlahisoa, ho fana ka potlako le tšireletso e phethiloeng ka mor'a thekiso, khetho e nepahetseng, khetho e ntle ka ho fetisisa.
Ka Ivan ho tloha Palestina - 2018.09.21 11:01 -
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