Filimi e rekisoang ea Machaena ea Magnetic Shielding - Filimi ea EMI Shielding e nang le Shielding e Ntle - Lucky Innovative
Filimi e rekisoang ea Machaena ea Magnetic Shielding - Filimi ea EMI Shielding e nang le Shielding e Ntle - Lucky Innovative
Filimi e rekisoang ea Machaena ea Magnetic Shielding - Filimi ea EMI Shielding e nang le Tšireletso e Ntle - Lintlha tse ncha tsa Lehlohonolo:
Tlhaloso ea Sehlahisoa
EMI Shielding Film e sebelisoa haholo ho FPC e nang le li-Modules tsa mehala ea cellular, PC, lisebelisoa tsa bongaka, lik'hamera tsa dijithale, lisebelisoa tsa likoloi, jj.
Ho fumaneha ha Sehlahisoa
LKES-800
LKES-1000
LEKS-6000
Likarolo tsa Sehlahisoa
(1) Litšobotsi tse ntle tsa ho sebetsa
(2) Ts'ebetso e ntle ea motlakase
(3) Lintho tse ntle tsa tšireletso
(4) Ho hanyetsa mocheso o motle
(5) E na le botsoalle ba tikoloho (Halogen mahala, e fihlela litlhoko tsa RoHS Directives le REACH, joalo-joalo)
Sebopeho sa Sehlahisoa
Litšobotsi tsa Sehlahisoa
LKES -800
| Ntho | Lintlha tsa Tlhahlobo | Teko e tloaelehileng kapa mokhoa oa Teko |
| Botenya (Pele Lamination, μm) | 16±10% | Maemo a Khoebo |
| Botenya (Kamora Lamination, μm) | 13±10% | Maemo a Khoebo |
| Ho Khanyetso ha Lefatše(Khauta e pentiloeng, φ 1.0mm, 1.0cm, Ω) | JIS C5016 1994-7.1 | |
| Matla a ho ebola a filimi e matlafalitsoeng (N/25mm) | Maemo a Khoebo | |
| Phatlalatso ea Soldering e sa Lefeng Pele (MAX 265℃) | Ha ho stratification; Ha ho phophomang | JIS C6471 1995-9.3 |
| Solder (288 ℃, 10s, makhetlo a 3) | Ha ho stratification; Ha ho phophomang | JIS C6471 1995-9.3 |
| Shielding Properties(dB) | >50 | GB/T 30142-2013 |
| Ho hanyetsana le Bokaholimo (mΩ/ □) | 350 | Mekhoa e Mene ea Terminal |
| Lelakabe le Retardant | VTM-0 | UL94 |
| Sebopeho sa ho Hatisa | PHASA | JIS K5600 |
| Ho benya(60°, Gs) | ＜20 | GB9754-88 |
| Ho hanyetsa lik'hemik'hale (Acid, alkali le OSP) | PHASA | JIS C6471 1995-9.2 |
| Ho khomarela ho Stiffener (N/cm) | ＞4 | IPC-TM-650 2.4.9 |
LKES-1000
| Ntho | Lintlha tsa Tlhahlobo | Teko e tloaelehileng kapa mokhoa oa Teko |
| Botenya (Kamora Lamination, μm) | 14-18 | Maemo a Khoebo |
| Shielding Properties(dB) | ≥50 | GB/T 30142-2013 |
| Insulation ea holim'a metsi | ≥200 | Maemo a Khoebo |
| Adhesive Fastness (Teko ea lisele tse Lekholo) | Ha ho sele e oang | JIS C 6471 1995-8.1 |
| Ho hanyetsa Joala ho Hlakola | 50 Times ha ho na tšenyo | Maemo a Khoebo |
| Khanyetso ea Scratch | Ka makhetlo a 5 ha ho Leakage ea tšepe | Maemo a Khoebo |
| Ho hanyetsana le fatše, (Ho pola ka khauta, φ 1.0mm, 1.0cm, Ω) | ≤1.0 | JIS C5016 1994-7.1 |
| Phatlalatso ea Soldering e sa Lefeng Pele (MAX 265℃) | Ha ho stratification; Ha ho phophomang | JIS C6471 1995-9.3 |
| Solder (288 ℃, 10s, makhetlo a 3) | Ha ho stratification; Ha ho phophomang | JIS C6471 1995-9.3 |
| Sebopeho sa ho Hatisa | PHASA | JIS K5600 |
LKES-6000
| Ntho | Lintlha tsa Tlhahlobo | Teko e tloaelehileng kapa mokhoa oa Teko |
| Botenya (Kamora Lamination, μm) | 13±10% | Maemo a Khoebo |
| Shielding Properties(dB) | ≥50 | GB/T 30142-2013 |
| Ho Khanyetso ha Lefatše, (Khauta e pentiloeng, φ 1.0mm, 1.0cm, Ω) | ≤0.5 | JIS C5016 1994-7.1 |
| Ho Khanyetso ha Lefatše, (Khauta e pentiloeng, φ 1.0mm, 3.0cm, Ω) | 0.20 | JIS C5016 1994-7.1 |
| Matla a ho lokolla (N/cm) | Maemo a Khoebo | |
| Surface Insulation (mΩ) | ≥200 | Maemo a Khoebo |
| Adhesive Fastness(Teko ea lisele tse Lekholo) | Ha ho sele e oang | JIS C 6471 1995-8.1 |
| Phatlalatso ea Soldering e sa Lefeng Pele (MAX 265℃) | Ha ho stratification; Ha ho phophomang | JIS C6471 1995-9.3 |
| Solder (288 ℃, 10s, makhetlo a 3) | Ha ho stratification; Ha ho phophomang | JIS C6471 1995-9.3 |
| Lelakabe le Retardant | VTM-0 | UL94 |
| Sebopeho sa ho Hatisa | PHASA | JIS K5600 |
Recommended Processing Condition
| Mokhoa oa Lamination | Boemo ba lamination | Boemo ba ho tiisa | |||
| Mocheso (℃) | Khatello(kg) | Nako (s) | Mocheso (℃) | Nako(mets) | |
| Potlako- Lamination | LKES800/6000:180±10LKES1000:175±5 | 100-120 | 80-120 | 160±10 | 30-60 |
Tlhokomeliso: Moreki a ka fetola theknoloji ho latela maemo a nnete ha a sebetsa.
(1) Hlakola lera la tšireletso pele, ebe u tlama FPC, 80 ℃ Tafole ea ho futhumatsa e ka sebelisoa bakeng sa ho kopanya pele.
(2) Laminate ho ea ka ts'ebetso e ka holimo, tlosa, ebe u ebola filimi e tsamaisang ka mor'a ho pholile.
(3) Ts'ebetso ea ho tiisa.
Ho paka
(1) Tlhaloso e tloaelehileng ea sehlahisoa: 250mm×100m.
(2) Kamora ho tlosa motlakase o sa fetoheng, lihlahisoa li pakiloe ka pampiri ea foil ea aluminium hape li kenyelletsoa ho omisa ho eona.
(3) Ka ntle ho phuthetsoe ka mabokoseng a pampiri 'me ho tsitsitsoe ho netefatsa polokeho ea lihlahisoa nakong ea lipalangoang le ho sebetsana, le ho qoba tšenyo.
Polokelo le Tlhokomelo
(1) Boemo ba polokelo bo khothalelitsoeng
Mocheso: (0-10)℃; Mongobo: ka tlase ho 70% RH
(2) Tlhokomeliso
(2.1) Ka kopo u se ke ua bula sephutheloana se ka ntle 'me u leka-lekanya filimi e sireletsang mocheso oa kamore bakeng sa lihora tsa 6 pele u sebelisa ho fokotsa phello ea serame le phoka filiming e sireletsang.
(2.2) Etsa tlhahiso ea hore e sebelisoe kapele kamoo ho ka khonehang ka mor'a ho tsoa sebakeng se batang, haeba boleng bo fetoha tlas'a mocheso o tloaelehileng nako e telele.
(2.3) Sehlahisoa sena ha se hanyetsane le moemeli oa tiiso ea metsi le phallo, haeba u na le theknoloji e ka holimo ea ho sebetsa, ka kopo leka le ho netefatsa pele.
(2.4) Etsa tlhahiso ea ho lamination ka potlako, vacuum laminating e hloka ho hlahlojoa le ho netefatsoa.
(2.5) Nako ea netefatso ea boleng tlasa maemo a kaholimo ke likhoeli tse 6.
Litšoantšo tsa lintlha tsa sehlahisoa:
Tataiso e Amanang ea Sehlahisoa:
Mokhatlo o boloka mohopolo oa ts'ebetso "tsamaiso ea mahlale, boleng bo holimo le boleng bo sebetsang, moreki ea phahameng ka ho fetesisa bakeng sa Filimi ea Machaena ea Magnetic Shielding - EMI Shielding Filimi e nang le Shielding e Ntle - Lucky Innovative , Sehlahisoa se tla fana ka lefats'e ka bophara, joalo ka: USA, Korea Boroa, Italy, Ho tataisoa ke litlhoko tsa bareki, ho fana ka boleng bo holimo le ho ntlafatsa boleng ba lits'ebeletso tsa bareki khafetsa. Litšebeletso. Re amohela metsoalle ka tieo ho buisana ka khoebo le ho qala tšebelisano le rona.
Ka Athena ho tsoa Slovakia - 2017.09.09 10:18 Re ananetsoe ka tlhahiso ea China, lekhetlong lena le eona ha ea ka ea re nyahamisa, mosebetsi o motle!
Ka Chris ho tsoa The Swiss - 2017.09.09 10:18 -
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