Filimi ea boleng bo holimo ea Copper Emi Shielding - Filimi ea EMI Shielding e nang le Shielding e Ntle

Filimi ea boleng bo holimo ea Copper Emi Shielding - Filimi ea EMI Shielding e nang le Shielding e Ntle - Lucky Innovative

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Lintlha tsa Sehlahisoa

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Maikutlo (2)

Lisebelisoa tse tsamaisoang hantle, sehlopha sa barekisi ba litsebi, le litšebeletso tse ntle ka mor'a thekiso; Hape re lelapa le leholo le kopaneng, motho e mong le e mong o khomarela boleng ba k'hamphani "kopano, boinehelo, mamello" bakeng saPampiri e Utloisisang Khatello,Sekhahla sa karete,Filimi ea Khatello e tlase, Ho ikitlaelletsa ho fumana katleho e tsoelang pele e thehiloeng boleng, botšepehi, botšepehi, le kutloisiso e feletseng ea matla a 'maraka.

Filimi ea boleng bo holimo ea Copper Emi Shielding - Filimi ea EMI Shielding e nang le Tšireletso e Ntle - Lintlha tse ncha tsa Lehlohonolo:

Tlhaloso ea Sehlahisoa

EMI Shielding Film e sebelisoa haholo ho FPC e nang le li-Modules tsa mehala ea cellular, PC, lisebelisoa tsa bongaka, lik'hamera tsa dijithale, lisebelisoa tsa likoloi, jj.

Ho fumaneha ha Sehlahisoa

LKES-800
LKES-1000
LEKS-6000

Likarolo tsa Sehlahisoa

(1) Litšobotsi tse ntle tsa ho sebetsa
(2) Ts'ebetso e ntle ea motlakase
(3) Lintho tse ntle tsa tšireletso
(4) Ho hanyetsa mocheso o motle
(5) E na le botsoalle ba tikoloho (Halogen mahala, e fihlela litlhoko tsa RoHS Directives le REACH, joalo-joalo)

Sebopeho sa Sehlahisoa

Filimi e omileng

Litšobotsi tsa Sehlahisoa

LKES -800

Ntho	Lintlha tsa Tlhahlobo	Teko e tloaelehileng kapa mokhoa oa Teko
Botenya (Pele Lamination, μm)	16±10%	Maemo a Khoebo
Botenya (Kamora Lamination, μm)	13±10%	Maemo a Khoebo
Ho Khanyetso ha Lefatše(Khauta e pentiloeng, φ 1.0mm, 1.0cm, Ω)		JIS C5016 1994-7.1
Matla a ho ebola a filimi e matlafalitsoeng (N/25mm)		Maemo a Khoebo
Phatlalatso ea Soldering e sa Lefeng Pele (MAX 265℃)	Ha ho stratification; Ha ho phophomang	JIS C6471 1995-9.3
Solder (288 ℃, 10s, makhetlo a 3)	Ha ho stratification; Ha ho phophomang	JIS C6471 1995-9.3
Shielding Properties(dB)	>50	GB/T 30142-2013
Ho hanyetsana le Bokaholimo (mΩ/ □)	350	Mekhoa e Mene ea Terminal
Lelakabe le Retardant	VTM-0	UL94
Sebopeho sa ho Hatisa	PHASA	JIS K5600
Ho benya(60°, Gs)	＜20	GB9754-88
Ho hanyetsa lik'hemik'hale (Acid, alkali le OSP)	PHASA	JIS C6471 1995-9.2
Ho khomarela ho Stiffener (N/cm)	＞4	IPC-TM-650 2.4.9

LKES-1000

Ntho	Lintlha tsa Tlhahlobo	Teko e tloaelehileng kapa mokhoa oa Teko
Botenya (Kamora Lamination, μm)	14-18	Maemo a Khoebo
Shielding Properties(dB)	≥50	GB/T 30142-2013
Insulation ea holim'a metsi	≥200	Maemo a Khoebo
Adhesive Fastness (Teko ea lisele tse Lekholo)	Ha ho sele e oang	JIS C 6471 1995-8.1
Ho hanyetsa Joala ho Hlakola	50 Times ha ho na tšenyo	Maemo a Khoebo
Khanyetso ea Scratch	Ka makhetlo a 5 ha ho Leakage ea tšepe	Maemo a Khoebo
Ho hanyetsana le fatše, (Ho pola ka khauta, φ 1.0mm, 1.0cm, Ω)	≤1.0	JIS C5016 1994-7.1
Phatlalatso ea Soldering e sa Lefeng Pele (MAX 265℃)	Ha ho stratification; Ha ho phophomang	JIS C6471 1995-9.3
Solder (288 ℃, 10s, makhetlo a 3)	Ha ho stratification; Ha ho phophomang	JIS C6471 1995-9.3
Sebopeho sa ho Hatisa	PHASA	JIS K5600

LKES-6000

Ntho	Lintlha tsa Tlhahlobo	Teko e tloaelehileng kapa mokhoa oa Teko
Botenya (Kamora Lamination, μm)	13±10%	Maemo a Khoebo
Shielding Properties(dB)	≥50	GB/T 30142-2013
Ho Khanyetso ha Lefatše, (Khauta e pentiloeng, φ 1.0mm, 1.0cm, Ω)	≤0.5	JIS C5016 1994-7.1
Ho Khanyetso ha Lefatše, (Khauta e pentiloeng, φ 1.0mm, 3.0cm, Ω)	0.20	JIS C5016 1994-7.1
Matla a ho lokolla (N/cm)		Maemo a Khoebo
Surface Insulation (mΩ)	≥200	Maemo a Khoebo
Adhesive Fastness(Teko ea lisele tse Lekholo)	Ha ho sele e oang	JIS C 6471 1995-8.1
Phatlalatso ea Soldering e sa Lefeng Pele (MAX 265℃)	Ha ho stratification; Ha ho phophomang	JIS C6471 1995-9.3
Solder (288 ℃, 10s, makhetlo a 3)	Ha ho stratification; Ha ho phophomang	JIS C6471 1995-9.3
Lelakabe le Retardant	VTM-0	UL94
Sebopeho sa ho Hatisa	PHASA	JIS K5600

Recommended Processing Condition

Mokhoa oa Lamination	Boemo ba lamination			Boemo ba ho tiisa
Mokhoa oa Lamination	Mocheso (℃)	Khatello(kg)	Nako (s)	Mocheso (℃)	Nako(mets)
Potlako- Lamination	LKES800/6000:180±10LKES1000:175±5	100-120	80-120	160±10	30-60

Tlhokomeliso: Moreki a ka fetola theknoloji ho latela maemo a nnete ha a sebetsa.
(1) Hlakola lera la tšireletso pele, ebe u tlama FPC, 80 ℃ Tafole ea ho futhumatsa e ka sebelisoa bakeng sa ho kopanya pele.
(2) Laminate ho ea ka ts'ebetso e ka holimo, tlosa, ebe u ebola filimi ea sephethephethe ka mor'a ho pholile.
(3) Ts'ebetso ea ho tiisa.

Ho paka

(1) Tlhaloso e tloaelehileng ea sehlahisoa: 250mm×100m.
(2) Kamora ho tlosa motlakase o sa fetoheng, lihlahisoa li pakiloe ka pampiri ea foil ea aluminium hape li kenyelletsoa ho omisa ho eona.
(3) Ka ntle ho phuthetsoe ka mabokoseng a pampiri 'me ho tsitsitsoe ho netefatsa polokeho ea lihlahisoa nakong ea lipalangoang le ho sebetsana, le ho qoba tšenyo.

Polokelo le Tlhokomelo

(1) Boemo ba polokelo bo khothalelitsoeng
Mocheso: (0-10)℃; Mongobo: ka tlase ho 70% RH
(2) Tlhokomeliso
(2.1) Ka kopo u se ke ua bula sephutheloana se ka ntle 'me u leka-lekanya filimi e sireletsang mocheso oa kamore bakeng sa lihora tsa 6 pele u sebelisa ho fokotsa phello ea serame le phoka filiming e sireletsang.
(2.2) Etsa tlhahiso ea hore e sebelisoe kapele kamoo ho ka khonehang ka mor'a ho tsoa sebakeng se batang, haeba boleng bo fetoha tlas'a mocheso o tloaelehileng nako e telele.
(2.3) Sehlahisoa sena ha se hanyetsane le moemeli oa tiiso ea metsi le phallo, haeba u na le theknoloji e ka holimo ea ho sebetsa, ka kopo leka le ho netefatsa pele.
(2.4) Etsa tlhahiso ea ho lamination ka potlako, vacuum laminating e hloka ho hlahlojoa le ho netefatsoa.
(2.5) Nako ea netefatso ea boleng tlasa maemo a kaholimo ke likhoeli tse 6.

Litšoantšo tsa lintlha tsa sehlahisoa:

Tataiso e Amanang ea Sehlahisoa:

Sepheo sa rona le khoebo e tla ba ho "Kamehla re phethahatsa litlhoko tsa bareki ba rona". Re tsoela pele ho fumana le ho hlophisa lintho tsa boleng bo holimo bakeng sa bareki ba rona ba babeli ba khale le ba bacha 'me re hlokomela tebello ea ho hapa moputso bakeng sa bareki ba rona hammoho le rona bakeng sa boleng bo botle ba Copper Film Emi Shielding - EMI Shielding Film with Good Shielding - Lucky Innovative , Sehlahisoa se tla fana ka lefats'e ka bophara, joalo ka: Australia , Jeddah , Stuttgart , Stuttprising convenition , Ka moea o motle ". 'me ho latela tataiso e joalo ea "boleng bo botle empa theko e betere," le "mokitlane oa lefats'e", re ntse re leka ka matla ho sebelisana le lik'hamphani tsa likarolo tsa makoloi lefatšeng ka bophara ho etsa selekane se atlehileng.

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