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Filimi ea boleng bo holimo ea Copper Emi Shielding - Filimi ea EMI Shielding e nang le Shielding e Ntle - Lucky Innovative

Filimi ea boleng bo holimo ea Copper Emi Shielding - Filimi ea EMI Shielding e nang le Shielding e Ntle - Lucky Innovative

Tlhaloso e Khutšoanyane:


Lintlha tsa Sehlahisoa

Li-tag tsa Sehlahisoa

E Amanang le Video

Maikutlo (2)

Re baetsi ba nang le phihlelo. Ho hapa bongata ho tsoa ho litifikeiti tsa bohlokoa tsa 'maraka oa eona bakeng saSesebelisoa sa Tekanyo ea Khatello,Smart Card Stripe,Khatello Pampiri, Hona joale re na le litharollo tse 'nè tse ka sehloohong. Lihlahisoa tsa rona li sebetsa ka ho fetisisa tse rekisoang eseng feela nakong ea 'maraka oa Chaena, empa hape li amoheloa nakong ea indasteri ea machaba.
Filimi ea boleng bo holimo ea Copper Emi Shielding - Filimi ea EMI Shielding e nang le Tšireletso e Ntle - Lintlha tse ncha tsa Lehlohonolo:

Tlhaloso ea Sehlahisoa

EMI Shielding Film e sebelisoa haholo ho FPC e nang le li-Modules tsa mehala ea cellular, PC, lisebelisoa tsa bongaka, lik'hamera tsa dijithale, lisebelisoa tsa likoloi, jj.

Ho fumaneha ha Sehlahisoa

LKES-800
LKES-1000
LEKS-6000

Likarolo tsa Sehlahisoa

(1) Litšobotsi tse ntle tsa ho sebetsa
(2) Ts'ebetso e ntle ea motlakase
(3) Lintho tse ntle tsa tšireletso
(4) Ho hanyetsa mocheso o motle
(5) E na le botsoalle ba tikoloho (Halogen mahala, e fihlela litlhoko tsa RoHS Directives le REACH, joalo-joalo)

Sebopeho sa Sehlahisoa

Filimi e omileng

Litšobotsi tsa Sehlahisoa

LKES -800

Ntho Lintlha tsa Tlhahlobo Teko e tloaelehileng kapa mokhoa oa Teko
Botenya (Pele Lamination, μm) 16±10% Maemo a Khoebo
Botenya (Kamora Lamination, μm) 13±10% Maemo a Khoebo
Ho Khanyetso ha Lefatše(Khauta e pentiloeng, φ 1.0mm, 1.0cm, Ω) JIS C5016 1994-7.1
Matla a ho ebola a filimi e matlafalitsoeng (N/25mm) Maemo a Khoebo
Phatlalatso ea Soldering e sa Lefeng Pele (MAX 265℃) Ha ho stratification; Ha ho phophomang JIS C6471 1995-9.3
Solder (288 ℃, 10s, makhetlo a 3) Ha ho stratification; Ha ho phophomang JIS C6471 1995-9.3
Shielding Properties(dB) >50 GB/T 30142-2013
Ho hanyetsana le Bokaholimo (mΩ/ □) 350 Mekhoa e Mene ea Terminal
Lelakabe le Retardant VTM-0 UL94
Sebopeho sa ho Hatisa PHASA JIS K5600
Ho benya(60°, Gs) <20 GB9754-88
Ho hanyetsa lik'hemik'hale (Acid, alkali le OSP) PHASA JIS C6471 1995-9.2
Ho khomarela ho Stiffener (N/cm) >4 IPC-TM-650 2.4.9

LKES-1000

Ntho Lintlha tsa Tlhahlobo Teko e tloaelehileng kapa mokhoa oa Teko
Botenya (Kamora Lamination, μm) 14-18 Maemo a Khoebo
Shielding Properties(dB) ≥50 GB/T 30142-2013
Insulation ea holim'a metsi ≥200 Maemo a Khoebo
Adhesive Fastness (Teko ea lisele tse Lekholo) Ha ho sele e oang JIS C 6471 1995-8.1
Ho hanyetsa Joala ho Hlakola 50 Times ha ho na tšenyo Maemo a Khoebo
Khanyetso ea Scratch Ka makhetlo a 5 ha ho Leakage ea tšepe Maemo a Khoebo
Ho hanyetsana le fatše, (Ho pola ka khauta, φ 1.0mm, 1.0cm, Ω) ≤1.0 JIS C5016 1994-7.1
Phatlalatso ea Soldering e sa Lefeng Pele (MAX 265℃) Ha ho stratification; Ha ho phophomang JIS C6471 1995-9.3
Solder (288 ℃, 10s, makhetlo a 3) Ha ho stratification; Ha ho phophomang JIS C6471 1995-9.3
Sebopeho sa ho Hatisa PHASA JIS K5600

LKES-6000

Ntho Lintlha tsa Tlhahlobo Teko e tloaelehileng kapa mokhoa oa Teko
Botenya (Kamora Lamination, μm) 13±10% Maemo a Khoebo
Shielding Properties(dB) ≥50 GB/T 30142-2013
Ho Khanyetso ha Lefatše, (Khauta e pentiloeng, φ 1.0mm, 1.0cm, Ω) ≤0.5 JIS C5016 1994-7.1
Ho Khanyetso ha Lefatše, (Khauta e pentiloeng, φ 1.0mm, 3.0cm, Ω) 0.20 JIS C5016 1994-7.1
Matla a ho lokolla (N/cm) Maemo a Khoebo
Surface Insulation (mΩ) ≥200 Maemo a Khoebo
Adhesive Fastness(Teko ea lisele tse Lekholo) Ha ho sele e oang JIS C 6471 1995-8.1
Phatlalatso ea Soldering e sa Lefeng Pele (MAX 265℃) Ha ho stratification; Ha ho phophomang JIS C6471 1995-9.3
Solder (288 ℃, 10s, makhetlo a 3) Ha ho stratification; Ha ho phophomang JIS C6471 1995-9.3
Lelakabe le Retardant VTM-0 UL94
Sebopeho sa ho Hatisa PHASA JIS K5600

Recommended Processing Condition

Mokhoa oa Lamination Boemo ba lamination Boemo ba ho tiisa

Mocheso ()

Khatello(kg)

Nako (s)

Mocheso ()

Nako(mets)

Potlako- Lamination LKES800/6000:180±10LKES1000:175±5 100-120 80-120 160±10 30-60

Tlhokomeliso: Moreki a ka fetola theknoloji ho latela maemo a nnete ha a sebetsa.
(1) Hlakola lera la tšireletso pele, ebe u tlama FPC, 80 ℃ Tafole ea ho futhumatsa e ka sebelisoa bakeng sa ho kopanya pele.
(2) Laminate ho ea ka ts'ebetso e ka holimo, tlosa, ebe u ebola filimi e tsamaisang ka mor'a ho pholile.
(3) Ts'ebetso ea ho tiisa.

Ho paka

(1) Tlhaloso e tloaelehileng ea sehlahisoa: 250mm×100m.
(2) Kamora ho tlosa motlakase o sa fetoheng, lihlahisoa li pakiloe ka pampiri ea foil ea aluminium hape li kenyelletsoa ho omisa ho eona.
(3) Ka ntle ho phuthetsoe ka mabokoseng a pampiri 'me ho tsitsitsoe ho netefatsa polokeho ea lihlahisoa nakong ea lipalangoang le ho sebetsana, le ho qoba tšenyo.

Polokelo le Tlhokomelo

(1) Boemo ba polokelo bo khothalelitsoeng
Mocheso: (0-10)℃; Mongobo: ka tlase ho 70% RH
(2) Tlhokomeliso
(2.1) Ka kopo u se ke ua bula sephutheloana se ka ntle 'me u leka-lekanya filimi e sireletsang mocheso oa kamore bakeng sa lihora tsa 6 pele u sebelisa ho fokotsa phello ea serame le phoka filiming e sireletsang.
(2.2) Etsa tlhahiso ea hore e sebelisoe kapele kamoo ho ka khonehang ka mor'a ho tsoa sebakeng se batang, haeba boleng bo fetoha tlas'a mocheso o tloaelehileng nako e telele.
(2.3) Sehlahisoa sena ha se hanyetsane le moemeli oa tiiso ea metsi le phallo, haeba u na le theknoloji e ka holimo ea ho sebetsa, ka kopo leka le ho netefatsa pele.
(2.4) Etsa tlhahiso ea ho lamination ka potlako, vacuum laminating e hloka ho hlahlojoa le ho netefatsoa.
(2.5) Nako ea netefatso ea boleng tlasa maemo a kaholimo ke likhoeli tse 6.


Litšoantšo tsa lintlha tsa sehlahisoa:

Filimi ea boleng bo holimo ea Copper Emi Shielding - Filimi ea EMI Shielding e nang le Shielding e Ntle - Lifoto tse qaqileng tsa Lucky Innovative

Filimi ea boleng bo holimo ea Copper Emi Shielding - Filimi ea EMI Shielding e nang le Shielding e Ntle - Lifoto tse qaqileng tsa Lucky Innovative

Filimi ea boleng bo holimo ea Copper Emi Shielding - Filimi ea EMI Shielding e nang le Shielding e Ntle - Lifoto tse qaqileng tsa Lucky Innovative

Filimi ea boleng bo holimo ea Copper Emi Shielding - Filimi ea EMI Shielding e nang le Shielding e Ntle - Lifoto tse qaqileng tsa Lucky Innovative

Filimi ea boleng bo holimo ea Copper Emi Shielding - Filimi ea EMI Shielding e nang le Shielding e Ntle - Lifoto tse qaqileng tsa Lucky Innovative

Filimi ea boleng bo holimo ea Copper Emi Shielding - Filimi ea EMI Shielding e nang le Shielding e Ntle - Lifoto tse qaqileng tsa Lucky Innovative


Tataiso e Amanang ea Sehlahisoa:

Khoebo ea rona e ntse e shebane le leano la mofuta. Monate oa bareki ke papatso ea rona e ntle ka ho fetisisa. Re boetse re fana ka k'hamphani ea OEM bakeng sa boleng bo botle ba Copper Film Emi Shielding - EMI Shielding Film with Good Shielding - Lucky Innovative , Sehlahisoa se tla fana ka lefats'e ka bophara, joalo ka: Turkmenistan , Paris , Germany , Ha u thahasella thepa leha e le efe ea rona ka mor'a hore u shebe lenane la lihlahisoa tsa rona, etsa bonnete ba hore u lokolohile ho ikopanya le rona bakeng sa lipotso. U tla khona ho re romella mangolo-tsoibila le ho ikopanya le rona bakeng sa lipuisano mme re tla u araba hang ha re khona. Haeba ho le bonolo, u ka fumana aterese ea rona sebakeng sa marang-rang 'me u kene khoebong ea rona. kapa lintlha tse ling tsa lihlahisoa tsa rona ka bouena. Ka kakaretso re malala-a-laotsoe ho aha likamano tsa nako e telele le tse tsitsitseng tsa tšebelisano-'moho le bareki leha e le bafe ba ka bang teng ka har'a masimo a amanang.
  • Baetsi bana ha baa ka ba hlompha feela khetho ea rona le litlhoko tsa rona, empa hape ba re file litlhahiso tse ngata tse ntle, qetellong, re atlehile ho phetha mesebetsi ea ho reka.
    5 LinaleliKa Lydia ho tloha Paris - 2018.06.21 17:11
    Mathata a ka rarolloa ka potlako le ka katleho, ho bohlokoa ho tšepana le ho sebetsa 'moho.
    5 LinaleliKa Mignon ho tsoa Ghana - 2018.09.23 17:37
    Ngola molaetsa wa hao mona mme o re romele wona