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Filimi ea boleng bo holimo ea Copper Emi Shielding - Filimi ea EMI Shielding e nang le Shielding e Ntle - Lucky Innovative

Filimi ea boleng bo holimo ea Copper Emi Shielding - Filimi ea EMI Shielding e nang le Shielding e Ntle - Lucky Innovative

Tlhaloso e Khutšoanyane:


Lintlha tsa Sehlahisoa

Li-tag tsa Sehlahisoa

E Amanang le Video

Maikutlo (2)

Re na le sehlopha sa litsebi, se sebetsang hantle ho fana ka litšebeletso tsa boleng ho bareki ba rona. Re lula re latela molao-motheo oa ho shebana le bareki, o tsepamisitseng lintlha haholo bakeng saFilimi ea Magnetic,Electronics Emi Rfi Shielding Tape,Filimi ea Emi Thermoplastic Shielding, Re tšepa ka tieo hore re ntse re hōla hammoho le bareki ba rona lefatšeng ka bophara.
Filimi ea boleng bo holimo ea Copper Emi Shielding - Filimi ea EMI Shielding e nang le Tšireletso e Ntle - Lintlha tse ncha tsa Lehlohonolo:

Tlhaloso ea Sehlahisoa

EMI Shielding Film e sebelisoa haholo ho FPC e nang le li-Modules tsa mehala ea cellular, PC, lisebelisoa tsa bongaka, lik'hamera tsa dijithale, lisebelisoa tsa likoloi, jj.

Ho fumaneha ha Sehlahisoa

LKES-800
LKES-1000
LEKS-6000

Likarolo tsa Sehlahisoa

(1) Litšobotsi tse ntle tsa ho sebetsa
(2) Ts'ebetso e ntle ea motlakase
(3) Lintho tse ntle tsa tšireletso
(4) Ho hanyetsa mocheso o motle
(5) E na le botsoalle ba tikoloho (Halogen mahala, e fihlela litlhoko tsa RoHS Directives le REACH, joalo-joalo)

Sebopeho sa Sehlahisoa

Filimi e omileng

Litšobotsi tsa Sehlahisoa

LKES -800

Ntho Lintlha tsa Tlhahlobo Teko e tloaelehileng kapa mokhoa oa Teko
Botenya (Pele Lamination, μm) 16±10% Maemo a Khoebo
Botenya (Kamora Lamination, μm) 13±10% Maemo a Khoebo
Ho Khanyetso ha Lefatše(Khauta e pentiloeng, φ 1.0mm, 1.0cm, Ω) JIS C5016 1994-7.1
Matla a ho ebola a filimi e matlafalitsoeng (N/25mm) Maemo a Khoebo
Phatlalatso ea Soldering e sa Lefeng Pele (MAX 265℃) Ha ho stratification; Ha ho phophomang JIS C6471 1995-9.3
Solder (288 ℃, 10s, makhetlo a 3) Ha ho stratification; Ha ho phophomang JIS C6471 1995-9.3
Shielding Properties(dB) >50 GB/T 30142-2013
Ho hanyetsana le Bokaholimo (mΩ/ □) 350 Mekhoa e Mene ea Terminal
Lelakabe le Retardant VTM-0 UL94
Sebopeho sa ho Hatisa PHASA JIS K5600
Ho benya(60°, Gs) <20 GB9754-88
Ho hanyetsa lik'hemik'hale (Acid, alkali le OSP) PHASA JIS C6471 1995-9.2
Ho khomarela ho Stiffener (N/cm) >4 IPC-TM-650 2.4.9

LKES-1000

Ntho Lintlha tsa Tlhahlobo Teko e tloaelehileng kapa mokhoa oa Teko
Botenya (Kamora Lamination, μm) 14-18 Maemo a Khoebo
Shielding Properties(dB) ≥50 GB/T 30142-2013
Insulation ea holim'a metsi ≥200 Maemo a Khoebo
Adhesive Fastness (Teko ea lisele tse Lekholo) Ha ho sele e oang JIS C 6471 1995-8.1
Ho hanyetsa Joala ho Hlakola 50 Times ha ho na tšenyo Maemo a Khoebo
Khanyetso ea Scratch Ka makhetlo a 5 ha ho Leakage ea tšepe Maemo a Khoebo
Ho hanyetsana le fatše, (Ho pola ka khauta, φ 1.0mm, 1.0cm, Ω) ≤1.0 JIS C5016 1994-7.1
Phatlalatso ea Soldering e sa Lefeng Pele (MAX 265℃) Ha ho stratification; Ha ho phophomang JIS C6471 1995-9.3
Solder (288 ℃, 10s, makhetlo a 3) Ha ho stratification; Ha ho phophomang JIS C6471 1995-9.3
Sebopeho sa ho Hatisa PHASA JIS K5600

LKES-6000

Ntho Lintlha tsa Tlhahlobo Teko e tloaelehileng kapa mokhoa oa Teko
Botenya (Kamora Lamination, μm) 13±10% Maemo a Khoebo
Shielding Properties(dB) ≥50 GB/T 30142-2013
Ho Khanyetso ha Lefatše, (Khauta e pentiloeng, φ 1.0mm, 1.0cm, Ω) ≤0.5 JIS C5016 1994-7.1
Ho Khanyetso ha Lefatše, (Khauta e pentiloeng, φ 1.0mm, 3.0cm, Ω) 0.20 JIS C5016 1994-7.1
Matla a ho lokolla (N/cm) Maemo a Khoebo
Surface Insulation (mΩ) ≥200 Maemo a Khoebo
Adhesive Fastness(Teko ea lisele tse Lekholo) Ha ho sele e oang JIS C 6471 1995-8.1
Phatlalatso ea Soldering e sa Lefeng Pele (MAX 265℃) Ha ho stratification; Ha ho phophomang JIS C6471 1995-9.3
Solder (288 ℃, 10s, makhetlo a 3) Ha ho stratification; Ha ho phophomang JIS C6471 1995-9.3
Lelakabe le Retardant VTM-0 UL94
Sebopeho sa ho Hatisa PHASA JIS K5600

Recommended Processing Condition

Mokhoa oa Lamination Boemo ba lamination Boemo ba ho tiisa

Mocheso ()

Khatello(kg)

Nako (s)

Mocheso ()

Nako(mets)

Potlako- Lamination LKES800/6000:180±10LKES1000:175±5 100-120 80-120 160±10 30-60

Tlhokomeliso: Moreki a ka fetola theknoloji ho latela maemo a nnete ha a sebetsa.
(1) Hlakola lera la tšireletso pele, ebe u tlama FPC, 80 ℃ Tafole ea ho futhumatsa e ka sebelisoa bakeng sa ho kopanya pele.
(2) Laminate ho ea ka ts'ebetso e ka holimo, tlosa, ebe u ebola filimi e tsamaisang ka mor'a ho pholile.
(3) Ts'ebetso ea ho tiisa.

Ho paka

(1) Tlhaloso e tloaelehileng ea sehlahisoa: 250mm×100m.
(2) Kamora ho tlosa motlakase o sa fetoheng, lihlahisoa li pakiloe ka pampiri ea foil ea aluminium hape li kenyelletsoa ho omisa ho eona.
(3) Ka ntle ho phuthetsoe ka mabokoseng a pampiri 'me ho tsitsitsoe ho netefatsa polokeho ea lihlahisoa nakong ea lipalangoang le ho sebetsana, le ho qoba tšenyo.

Polokelo le Tlhokomelo

(1) Boemo ba polokelo bo khothalelitsoeng
Mocheso: (0-10)℃; Mongobo: ka tlase ho 70% RH
(2) Tlhokomeliso
(2.1) Ka kopo u se ke ua bula sephutheloana se ka ntle 'me u leka-lekanya filimi e sireletsang mocheso oa kamore bakeng sa lihora tsa 6 pele u sebelisa ho fokotsa phello ea serame le phoka filiming e sireletsang.
(2.2) Etsa tlhahiso ea hore e sebelisoe kapele kamoo ho ka khonehang ka mor'a ho tsoa sebakeng se batang, haeba boleng bo fetoha tlas'a mocheso o tloaelehileng nako e telele.
(2.3) Sehlahisoa sena ha se hanyetsane le moemeli oa tiiso ea metsi le phallo, haeba u na le theknoloji e ka holimo ea ho sebetsa, ka kopo leka le ho netefatsa pele.
(2.4) Etsa tlhahiso ea ho lamination ka potlako, vacuum laminating e hloka ho hlahlojoa le ho netefatsoa.
(2.5) Nako ea netefatso ea boleng tlasa maemo a kaholimo ke likhoeli tse 6.


Litšoantšo tsa lintlha tsa sehlahisoa:

Filimi ea boleng bo holimo ea Copper Emi Shielding - Filimi ea EMI Shielding e nang le Shielding e Ntle - Lifoto tse qaqileng tsa Lucky Innovative

Filimi ea boleng bo holimo ea Copper Emi Shielding - Filimi ea EMI Shielding e nang le Shielding e Ntle - Lifoto tse qaqileng tsa Lucky Innovative

Filimi ea boleng bo holimo ea Copper Emi Shielding - Filimi ea EMI Shielding e nang le Shielding e Ntle - Lifoto tse qaqileng tsa Lucky Innovative

Filimi ea boleng bo holimo ea Copper Emi Shielding - Filimi ea EMI Shielding e nang le Shielding e Ntle - Lifoto tse qaqileng tsa Lucky Innovative

Filimi ea boleng bo holimo ea Copper Emi Shielding - Filimi ea EMI Shielding e nang le Shielding e Ntle - Lifoto tse qaqileng tsa Lucky Innovative

Filimi ea boleng bo holimo ea Copper Emi Shielding - Filimi ea EMI Shielding e nang le Shielding e Ntle - Lifoto tse qaqileng tsa Lucky Innovative


Tataiso e Amanang ea Sehlahisoa:

Hangata re phehella khopolo ea "Quality To start with, Prestige Supreme". Re ikemiselitse ka botlalo ho fana ka bareki ba rona ka thepa ea boleng bo holimo ba tlholisano, ho fana ka potlako le tšehetso e nang le boiphihlelo bakeng sa boleng bo holimo ba Copper Film Emi Shielding - EMI Shielding Film with Good Shielding - Lucky Innovative , Sehlahisoa se tla fana ka lefats'e ka bophara, joalo ka: Oslo , Munich , Sweden , Ka boiphihlelo ba eona ba ho etsa lihlahisoa tse ngata, k'hamphani e se e rekisitse lihlahisoa tsa boleng bo holimo ka mor'a hore e rekisoe. e 'ngoe ea likhoebo tse tummeng tse ikhethetseng lihlahisoa tsa lihlahisoa.Re na le tšepo e tiileng ea ho theha kamano ea khoebo le uena le ho lelekisa melemo ea bobeli.
  • Basebeletsi ba theknoloji ea fektheri ha ba na theknoloji e phahameng feela, boemo ba bona ba Senyesemane le bona bo molemo haholo, sena ke thuso e kholo ho puisano ea theknoloji.
    5 LinaleliKa Fanny ho tsoa Netherlands - 2018.11.06 10:04
    Theknoloji e ntle haholo, ts'ebeletso e phethahetseng ea kamora thekiso le ts'ebetso e sebetsang hantle, re nahana hore ena ke khetho ea rona e ntle ka ho fetisisa.
    5 LinaleliKa Jean ea tsoang Albania - 2018.07.27 12:26
    Ngola molaetsa wa hao mona mme o re romele wona