Emi Copper Foil Shielding Tape ea boleng bo botle - Filimi ea EMI Shielding e nang le Shielding e ntle

Theipi ea boleng bo botle ea Emi Copper Foil Shielding - Filimi ea EMI Shielding e nang le Shielding e Ntle - Sets'oants'o sa Lucky Innovative Featured

Emi Copper Foil Shielding Tape ea boleng bo botle - Filimi ea EMI Shielding e nang le Shielding e ntle - Lucky Innovative

Tlhaloso e Khutšoanyane:

Lintlha tsa Sehlahisoa

Li-tag tsa Sehlahisoa

E Amanang le Video

Maikutlo (2)

Re phehella molao oa tsamaiso oa "Boleng bo ikhethile, Mofani o phahame, Lebitso ke la pele", 'me re tla theha le ho arolelana katleho le bareki bohle bakeng saHico Stripe,Filimi ea Khatello ea Wafer Bonding,Credit Card Magstripe, Botšepehi ke molao-motheo oa rona, ts'ebetso ea litsebi ke mosebetsi oa rona, tšebeletso ke sepheo sa rona, 'me khotsofalo ea bareki ke bokamoso ba rona!

Emi Copper Foil Shielding Tape ea boleng bo botle - Filimi ea EMI Shielding e nang le Tšireletso e Ntle - Lintlha tse ncha tsa Lehlohonolo:

Tlhaloso ea Sehlahisoa

EMI Shielding Film e sebelisoa haholo ho FPC e nang le li-Modules tsa mehala ea cellular, PC, lisebelisoa tsa bongaka, lik'hamera tsa dijithale, lisebelisoa tsa likoloi, jj.

Ho fumaneha ha Sehlahisoa

LKES-800
LKES-1000
LEKS-6000

Likarolo tsa Sehlahisoa

(1) Litšobotsi tse ntle tsa ho sebetsa
(2) Ts'ebetso e ntle ea motlakase
(3) Lintho tse ntle tsa tšireletso
(4) Ho hanyetsa mocheso o motle
(5) E na le botsoalle ba tikoloho (Halogen mahala, e fihlela litlhoko tsa RoHS Directives le REACH, joalo-joalo)

Sebopeho sa Sehlahisoa

Filimi e omileng

Litšobotsi tsa Sehlahisoa

LKES -800

Ntho	Lintlha tsa Tlhahlobo	Teko e tloaelehileng kapa mokhoa oa Teko
Botenya (Pele Lamination, μm)	16±10%	Maemo a Khoebo
Botenya (Kamora Lamination, μm)	13±10%	Maemo a Khoebo
Ho Khanyetso ha Lefatše(Khauta e pentiloeng, φ 1.0mm, 1.0cm, Ω)		JIS C5016 1994-7.1
Matla a ho ebola a filimi e matlafalitsoeng (N/25mm)		Maemo a Khoebo
Phatlalatso ea Soldering e sa Lefeng Pele (MAX 265℃)	Ha ho stratification; Ha ho phophomang	JIS C6471 1995-9.3
Solder (288 ℃, 10s, makhetlo a 3)	Ha ho stratification; Ha ho phophomang	JIS C6471 1995-9.3
Shielding Properties(dB)	>50	GB/T 30142-2013
Ho hanyetsana le Bokaholimo (mΩ/ □)	350	Mekhoa e Mene ea Terminal
Lelakabe le Retardant	VTM-0	UL94
Sebopeho sa ho Hatisa	PHASA	JIS K5600
Ho benya(60°, Gs)	＜20	GB9754-88
Ho hanyetsa lik'hemik'hale (Acid, alkali le OSP)	PHASA	JIS C6471 1995-9.2
Ho khomarela ho Stiffener (N/cm)	＞4	IPC-TM-650 2.4.9

LKES-1000

Ntho	Lintlha tsa Tlhahlobo	Teko e tloaelehileng kapa mokhoa oa Teko
Botenya (Kamora Lamination, μm)	14-18	Maemo a Khoebo
Shielding Properties(dB)	≥50	GB/T 30142-2013
Insulation ea holim'a metsi	≥200	Maemo a Khoebo
Adhesive Fastness (Teko ea lisele tse Lekholo)	Ha ho sele e oang	JIS C 6471 1995-8.1
Ho hanyetsa Joala ho Hlakola	50 Times ha ho na tšenyo	Maemo a Khoebo
Khanyetso ea Scratch	Ka makhetlo a 5 ha ho Leakage ea tšepe	Maemo a Khoebo
Ho hanyetsana le fatše, (Ho pola ka khauta, φ 1.0mm, 1.0cm, Ω)	≤1.0	JIS C5016 1994-7.1
Phatlalatso ea Soldering e sa Lefeng Pele (MAX 265℃)	Ha ho stratification; Ha ho phophomang	JIS C6471 1995-9.3
Solder (288 ℃, 10s, makhetlo a 3)	Ha ho stratification; Ha ho phophomang	JIS C6471 1995-9.3
Sebopeho sa ho Hatisa	PHASA	JIS K5600

LKES-6000

Ntho	Lintlha tsa Tlhahlobo	Teko e tloaelehileng kapa mokhoa oa Teko
Botenya (Kamora Lamination, μm)	13±10%	Maemo a Khoebo
Shielding Properties(dB)	≥50	GB/T 30142-2013
Ho Khanyetso ha Lefatše, (Khauta e pentiloeng, φ 1.0mm, 1.0cm, Ω)	≤0.5	JIS C5016 1994-7.1
Ho Khanyetso ha Lefatše, (Khauta e pentiloeng, φ 1.0mm, 3.0cm, Ω)	0.20	JIS C5016 1994-7.1
Matla a ho lokolla (N/cm)		Maemo a Khoebo
Surface Insulation (mΩ)	≥200	Maemo a Khoebo
Adhesive Fastness(Teko ea lisele tse Lekholo)	Ha ho sele e oang	JIS C 6471 1995-8.1
Phatlalatso ea Soldering e sa Lefeng Pele (MAX 265℃)	Ha ho stratification; Ha ho phophomang	JIS C6471 1995-9.3
Solder (288 ℃, 10s, makhetlo a 3)	Ha ho stratification; Ha ho phophomang	JIS C6471 1995-9.3
Lelakabe le Retardant	VTM-0	UL94
Sebopeho sa ho Hatisa	PHASA	JIS K5600

Recommended Processing Condition

Mokhoa oa Lamination	Boemo ba lamination			Boemo ba ho tiisa
Mokhoa oa Lamination	Mocheso (℃)	Khatello(kg)	Nako (s)	Mocheso (℃)	Nako(mets)
Potlako- Lamination	LKES800/6000:180±10LKES1000:175±5	100-120	80-120	160±10	30-60

Tlhokomeliso: Moreki a ka fetola theknoloji ho latela maemo a nnete ha a sebetsa.
(1) Hlakola lera la tšireletso pele, ebe u tlama FPC, 80 ℃ Tafole ea ho futhumatsa e ka sebelisoa bakeng sa ho kopanya pele.
(2) Laminate ho ea ka ts'ebetso e ka holimo, tlosa, ebe u ebola filimi ea sephethephethe ka mor'a ho pholile.
(3) Ts'ebetso ea ho tiisa.

Ho paka

(1) Tlhaloso e tloaelehileng ea sehlahisoa: 250mm×100m.
(2) Kamora ho tlosa motlakase o sa fetoheng, lihlahisoa li pakiloe ka pampiri ea foil ea aluminium hape li kenyelletsoa ho omisa ho eona.
(3) Ka ntle ho phuthetsoe ka mabokoseng a pampiri 'me ho tsitsitsoe ho netefatsa polokeho ea lihlahisoa nakong ea lipalangoang le ho sebetsana, le ho qoba tšenyo.

Polokelo le Tlhokomelo

(1) Boemo ba polokelo bo khothalelitsoeng
Mocheso: (0-10)℃; Mongobo: ka tlase ho 70% RH
(2) Tlhokomeliso
(2.1) Ka kopo u se ke ua bula sephutheloana se ka ntle 'me u leka-lekanya filimi e sireletsang mocheso oa kamore bakeng sa lihora tsa 6 pele u sebelisa ho fokotsa phello ea serame le phoka filiming e sireletsang.
(2.2) Etsa tlhahiso ea hore e sebelisoe kapele kamoo ho ka khonehang ka mor'a ho tsoa sebakeng se batang, haeba boleng bo fetoha tlas'a mocheso o tloaelehileng nako e telele.
(2.3) Sehlahisoa sena ha se hanyetsane le moemeli oa tiiso ea metsi le phallo, haeba u na le theknoloji e ka holimo ea ho sebetsa, ka kopo leka le ho netefatsa pele.
(2.4) Etsa tlhahiso ea ho lamination ka potlako, vacuum laminating e hloka ho hlahlojoa le ho netefatsoa.
(2.5) Nako ea netefatso ea boleng tlasa maemo a kaholimo ke likhoeli tse 6.

Litšoantšo tsa lintlha tsa sehlahisoa:

Tataiso e Amanang ea Sehlahisoa:

Re lula re u fa litšebeletso tsa bareki tse hlokolosi ka ho fetesisa, le mefuta e fapaneng e pharalletseng ea meralo le litaele tse nang le thepa e ntlehali. Boiteko bona bo kenyelletsa ho fumaneha ha meralo e hlophisitsoeng ka lebelo le ho romelloa bakeng sa boleng bo botle ba Emi Copper Foil Shielding Tape - EMI Shielding Film with Good Shielding - Lucky Innovative , Sehlahisoa se tla fana ka lefats'e ka bophara, joalo ka: Los Angeles , UAE , Turin , re na le tšepo e tiileng ea ho theha kamano e le 'ngoe e ntle ea nako e telele ea khoebo le k'hamphani ea khoebo ea nako e telele e nang le monyetla oa ho hlōla, ho hapa leano la khoebo le ho hapa leano la khoebo le ho hapa leano la khoebo le ho hapa leano la hau. ho fihlela nakong e tlang.

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