Theipi ya Tshireletso ya Boleng bo Botle - Filimi ya EMI Shielding e nang le Tshireletso e Ntle

Theipi ea boleng bo botle e sireletsang - Filimi ea EMI Shielding e nang le Tšireletso e Ntle - Sets'oants'o sa Lehlohonolo

Theipi ya Tshireletso ya Boleng bo Botle - Filimi ya EMI Shielding e nang le Tshireletso e Ntle – Lehlohonolo le Botjha

Tlhaloso e Khutšoanyane:

Lintlha tsa Sehlahisoa

Li-tag tsa Sehlahisoa

E Amanang le Video

Maikutlo (2)

Re sebelisa tsamaiso e felletseng ea boleng bo botle ba mahlale, boleng bo botle haholo le tumelo e phahameng, re hapa maemo a matle mme ra nka taeo ena bakeng saMagnetic Stripe Atm Card,Filme ea Tlhahiso ea Potoloho ea Photosensitive,Leqephe la Pampiri ea Khatello ea Pele, Haeba u thahasella ntho leha e le efe ea rona, ka kopo u se ke ua tsilatsila ho iteanya le rona 'me u nke mohato oa pele oa ho theha kamano e atlehileng ea khoebo.

Theipi ya Tshireletso ya Boleng bo Botle - Filimi ya EMI e Shielding e nang le Tshireletso e Ntle – Lehlohonolo la Boqapi:

Tlhaloso ea Sehlahisoa

EMI Shielding Film e sebelisoa haholo ho FPC e nang le li-Modules tsa mehala ea cellular, PC, lisebelisoa tsa bongaka, lik'hamera tsa dijithale, lisebelisoa tsa likoloi, jj.

Ho fumaneha ha Sehlahisoa

LKES-800
LKES-1000
LEKS-6000

Likarolo tsa Sehlahisoa

(1) Litšobotsi tse ntle tsa ho sebetsa
(2) Ts'ebetso e ntle ea motlakase
(3) Lintho tse ntle tsa tšireletso
(4) Ho hanyetsa mocheso o motle
(5) E na le botsoalle ba tikoloho (Halogen mahala, e fihlela litlhoko tsa RoHS Directives le REACH, joalo-joalo)

Sebopeho sa Sehlahisoa

Filimi e omileng

Litšobotsi tsa Sehlahisoa

LKES -800

Ntho	Lintlha tsa Tlhahlobo	Teko e tloaelehileng kapa mokhoa oa Teko
Botenya (Pele Lamination, μm)	16±10%	Maemo a Khoebo
Botenya (Kamora Lamination, μm)	13±10%	Maemo a Khoebo
Ho Khanyetso ha Lefatše(Khauta e pentiloeng, φ 1.0mm, 1.0cm, Ω)		JIS C5016 1994-7.1
Matla a ho ebola a filimi e matlafalitsoeng (N/25mm)		Maemo a Khoebo
Phatlalatso ea Soldering e sa Lefeng Pele (MAX 265℃)	Ha ho stratification; Ha ho phophomang	JIS C6471 1995-9.3
Solder (288 ℃, 10s, makhetlo a 3)	Ha ho stratification; Ha ho phophomang	JIS C6471 1995-9.3
Shielding Properties(dB)	>50	GB/T 30142-2013
Ho hanyetsana le Bokaholimo (mΩ/ □)	350	Mekhoa e Mene ea Terminal
Lelakabe le Retardant	VTM-0	UL94
Sebopeho sa ho Hatisa	PHASA	JIS K5600
Ho benya(60°, Gs)	＜20	GB9754-88
Ho hanyetsa lik'hemik'hale (Acid, alkali le OSP)	PHASA	JIS C6471 1995-9.2
Ho khomarela ho Stiffener (N/cm)	＞4	IPC-TM-650 2.4.9

LKES-1000

Ntho	Lintlha tsa Tlhahlobo	Teko e tloaelehileng kapa mokhoa oa Teko
Botenya (Kamora Lamination, μm)	14-18	Maemo a Khoebo
Shielding Properties(dB)	≥50	GB/T 30142-2013
Insulation ea holim'a metsi	≥200	Maemo a Khoebo
Adhesive Fastness (Teko ea lisele tse Lekholo)	Ha ho sele e oang	JIS C 6471 1995-8.1
Ho hanyetsa Joala ho Hlakola	50 Times ha ho na tšenyo	Maemo a Khoebo
Khanyetso ea Scratch	Ka makhetlo a 5 ha ho Leakage ea tšepe	Maemo a Khoebo
Ho hanyetsana le fatše, (Ho pola ka khauta, φ 1.0mm, 1.0cm, Ω)	≤1.0	JIS C5016 1994-7.1
Phatlalatso ea Soldering e sa Lefeng Pele (MAX 265℃)	Ha ho stratification; Ha ho phophomang	JIS C6471 1995-9.3
Solder (288 ℃, 10s, makhetlo a 3)	Ha ho stratification; Ha ho phophomang	JIS C6471 1995-9.3
Sebopeho sa ho Hatisa	PHASA	JIS K5600

LKES-6000

Ntho	Lintlha tsa Tlhahlobo	Teko e tloaelehileng kapa mokhoa oa Teko
Botenya (Kamora Lamination, μm)	13±10%	Maemo a Khoebo
Shielding Properties(dB)	≥50	GB/T 30142-2013
Ho Khanyetso ha Lefatše, (Khauta e pentiloeng, φ 1.0mm, 1.0cm, Ω)	≤0.5	JIS C5016 1994-7.1
Ho Khanyetso ha Lefatše, (Khauta e pentiloeng, φ 1.0mm, 3.0cm, Ω)	0.20	JIS C5016 1994-7.1
Matla a ho lokolla (N/cm)		Maemo a Khoebo
Surface Insulation (mΩ)	≥200	Maemo a Khoebo
Adhesive Fastness(Teko ea lisele tse Lekholo)	Ha ho sele e oang	JIS C 6471 1995-8.1
Phatlalatso ea Soldering e sa Lefeng Pele (MAX 265℃)	Ha ho stratification; Ha ho phophomang	JIS C6471 1995-9.3
Solder (288 ℃, 10s, makhetlo a 3)	Ha ho stratification; Ha ho phophomang	JIS C6471 1995-9.3
Lelakabe le Retardant	VTM-0	UL94
Sebopeho sa ho Hatisa	PHASA	JIS K5600

Recommended Processing Condition

Mokhoa oa Lamination	Boemo ba lamination			Boemo ba ho tiisa
Mokhoa oa Lamination	Mocheso (℃)	Khatello(kg)	Nako (s)	Mocheso (℃)	Nako(mets)
Potlako- Lamination	LKES800/6000:180±10LKES1000:175±5	100-120	80-120	160±10	30-60

Tlhokomeliso: Moreki a ka fetola theknoloji ho latela maemo a nnete ha a sebetsa.
(1) Hlakola lera la tšireletso pele, ebe u tlama FPC, 80 ℃ Tafole ea ho futhumatsa e ka sebelisoa bakeng sa ho kopanya pele.
(2) Laminate ho ea ka ts'ebetso e ka holimo, tlosa, ebe u ebola filimi e tsamaisang ka mor'a ho pholile.
(3) Ts'ebetso ea ho tiisa.

Ho paka

(1) Tlhaloso e tloaelehileng ea sehlahisoa: 250mm×100m.
(2) Kamora ho tlosa motlakase o sa fetoheng, lihlahisoa li pakiloe ka pampiri ea foil ea aluminium hape li kenyelletsoa ho omisa ho eona.
(3) Ka ntle ho phuthetsoe ka mabokoseng a pampiri 'me ho tsitsitsoe ho netefatsa polokeho ea lihlahisoa nakong ea lipalangoang le ho sebetsana, le ho qoba tšenyo.

Polokelo le Tlhokomelo

(1) Boemo ba polokelo bo khothalelitsoeng
Mocheso: (0-10)℃; Mongobo: ka tlase ho 70% RH
(2) Tlhokomeliso
(2.1) Ka kopo u se ke ua bula sephutheloana se ka ntle 'me u leka-lekanya filimi e sireletsang mocheso oa kamore bakeng sa lihora tsa 6 pele u sebelisa ho fokotsa phello ea serame le phoka filiming e sireletsang.
(2.2) Etsa tlhahiso ea hore e sebelisoe kapele kamoo ho ka khonehang ka mor'a ho tsoa sebakeng se batang, haeba boleng bo fetoha tlas'a mocheso o tloaelehileng nako e telele.
(2.3) Sehlahisoa sena ha se hanyetsane le moemeli oa tiiso ea metsi le phallo, haeba u na le theknoloji e ka holimo ea ho sebetsa, ka kopo leka le ho netefatsa pele.
(2.4) Etsa tlhahiso ea ho lamination ka potlako, vacuum laminating e hloka ho hlahlojoa le ho netefatsoa.
(2.5) Nako ea netefatso ea boleng tlasa maemo a kaholimo ke likhoeli tse 6.

Litšoantšo tsa lintlha tsa sehlahisoa:

Tataiso e Amanang ea Sehlahisoa:

Hammoho le filosofi ea khoebo ea "Client-Oriented", ts'ebetso e matla ea taolo ea boleng bo holimo, lihlahisoa tse phahameng tsa tlhahiso hammoho le sehlopha se matla sa R&D, re lula re fana ka lihlahisoa tsa boleng bo holimo, litharollo tse ikhethang le litšenyehelo tse matla bakeng sa Theipi ea Tšireletso ea Boleng bo Botle - Filimi ea EMI Shielding e nang le Tšireletso e Ntle - Lucky Innovative e kang , Toronto, Toronto Mozambique, Sehlopha sa rona sa boenjiniere se tšoanelehang hangata se tla itokisetsa ho u sebeletsa bakeng sa lipuisano le maikutlo. Re boetse re khona ho u fa lisampole tsa mahala ho fihlela litlhoko tsa hau. Ho ka etsoa boiteko bo matla ho u fa litšebeletso le lihlahisoa tse nepahetseng. Bakeng sa mang kapa mang ea nang le thahasello k'hamphaning le linthong tsa rona, ka kopo ikopanye le rona ka ho re romella mangolo-tsoibila kapa ho ikopanya le rona hanghang. Bakeng sa ho tseba litharollo tsa rona le mokhatlo. ho feta, o ka tla fekthering ea rona ho tseba hore na. Hangata re tlil'o amohela baeti ba tsoang lefats'eng ka bophara ho tlatlapa ea rona. o theha likamano tsa likhoebo tse nyane le rona. Ka kopo, ikutloe u se na litšenyehelo tsa ho bua le rona bakeng sa khoebo. 'me re lumela hore re tla arolelana boiphihlelo bo sebetsang ka ho fetesisa ba khoebo le barekisi bohle ba rona.

Thepa ea Tšireletso ea Cable

Tšireletso ea Koporo ea Foil

Theipi ea Koporo Emi Shielding

Emi Rfi Shielding Tape

Lifilimi tsa Emi Shielding

Emi Shielding Mesh Tape

Emi Shielding Wrap

Filimi ea Emi Thermoplastic Shielding

Foil Shielding

Filimi ea Magnetic Shielding

Basebeletsi ba fektheri ba na le moea o motle oa sehlopha, kahoo re fumane lihlahisoa tsa boleng bo phahameng ka potlako, ho phaella moo, theko e boetse e loketse, ena ke baetsi ba Chaena ba molemo haholo le ba ka tšeptjoang.
5 Linaleli