banner

Theipi ea boleng bo holimo ea Emi Shielding - Filimi ea EMI Shielding e nang le Tšireletso e Ntle - Lucky Innovative

Theipi ea boleng bo holimo ea Emi Shielding - Filimi ea EMI Shielding e nang le Tšireletso e Ntle - Lucky Innovative

Tlhaloso e Khutšoanyane:


Lintlha tsa Sehlahisoa

Li-tag tsa Sehlahisoa

E Amanang le Video

Maikutlo (2)

Re lula re phethahatsa moea oa rona oa ''Boqapi bo tlisang nts'etsopele, boleng bo holimo bo netefatsang ho iphelisa, Tsamaiso e khothaletsang melemo, e hohela bareki bakeng saMebala e Fetolang Khatello Pampiri,Mokhoa oa ho Lekola Head Gasket,Karete ea Atm ea Magnetic Chip, Ha re ntse re sebelisa tenet ea "tumelo-based, moreki pele", re amohela bareki ho founela kapa e-mail re bakeng sa tšebelisano.
Theipi ea boleng bo holimo ea Emi Shielding - Filimi ea EMI Shielding e nang le Tšireletso e Ntle - Lintlha tse ncha tsa Lehlohonolo:

Tlhaloso ea Sehlahisoa

EMI Shielding Film e sebelisoa haholo ho FPC e nang le li-Modules tsa mehala ea cellular, PC, lisebelisoa tsa bongaka, lik'hamera tsa dijithale, lisebelisoa tsa likoloi, jj.

Ho fumaneha ha Sehlahisoa

LKES-800
LKES-1000
LEKS-6000

Likarolo tsa Sehlahisoa

(1) Litšobotsi tse ntle tsa ho sebetsa
(2) Ts'ebetso e ntle ea motlakase
(3) Lintho tse ntle tsa tšireletso
(4) Ho hanyetsa mocheso o motle
(5) E na le botsoalle ba tikoloho (Halogen mahala, e fihlela litlhoko tsa RoHS Directives le REACH, joalo-joalo)

Sebopeho sa Sehlahisoa

Filimi e omileng

Litšobotsi tsa Sehlahisoa

LKES -800

Ntho Lintlha tsa Tlhahlobo Teko e tloaelehileng kapa mokhoa oa Teko
Botenya (Pele Lamination, μm) 16±10% Maemo a Khoebo
Botenya (Kamora Lamination, μm) 13±10% Maemo a Khoebo
Ho Khanyetso ha Lefatše(Khauta e pentiloeng, φ 1.0mm, 1.0cm, Ω) JIS C5016 1994-7.1
Matla a ho ebola a filimi e matlafalitsoeng (N/25mm) Maemo a Khoebo
Phatlalatso ea Soldering e sa Lefeng Pele (MAX 265℃) Ha ho stratification; Ha ho phophomang JIS C6471 1995-9.3
Solder (288 ℃, 10s, makhetlo a 3) Ha ho stratification; Ha ho phophomang JIS C6471 1995-9.3
Shielding Properties(dB) >50 GB/T 30142-2013
Ho hanyetsana le Bokaholimo (mΩ/ □) 350 Mekhoa e Mene ea Terminal
Lelakabe le Retardant VTM-0 UL94
Sebopeho sa ho Hatisa PHASA JIS K5600
Ho benya(60°, Gs) <20 GB9754-88
Ho hanyetsa lik'hemik'hale (Acid, alkali le OSP) PHASA JIS C6471 1995-9.2
Ho khomarela ho Stiffener (N/cm) >4 IPC-TM-650 2.4.9

LKES-1000

Ntho Lintlha tsa Tlhahlobo Teko e tloaelehileng kapa mokhoa oa Teko
Botenya (Kamora Lamination, μm) 14-18 Maemo a Khoebo
Shielding Properties(dB) ≥50 GB/T 30142-2013
Insulation ea holim'a metsi ≥200 Maemo a Khoebo
Adhesive Fastness (Teko ea lisele tse Lekholo) Ha ho sele e oang JIS C 6471 1995-8.1
Ho hanyetsa Joala ho Hlakola 50 Times ha ho na tšenyo Maemo a Khoebo
Khanyetso ea Scratch Ka makhetlo a 5 ha ho Leakage ea tšepe Maemo a Khoebo
Ho hanyetsana le fatše, (Ho pola ka khauta, φ 1.0mm, 1.0cm, Ω) ≤1.0 JIS C5016 1994-7.1
Phatlalatso ea Soldering e sa Lefeng Pele (MAX 265℃) Ha ho stratification; Ha ho phophomang JIS C6471 1995-9.3
Solder (288 ℃, 10s, makhetlo a 3) Ha ho stratification; Ha ho phophomang JIS C6471 1995-9.3
Sebopeho sa ho Hatisa PHASA JIS K5600

LKES-6000

Ntho Lintlha tsa Tlhahlobo Teko e tloaelehileng kapa mokhoa oa Teko
Botenya (Kamora Lamination, μm) 13±10% Maemo a Khoebo
Shielding Properties(dB) ≥50 GB/T 30142-2013
Ho Khanyetso ha Lefatše, (Khauta e pentiloeng, φ 1.0mm, 1.0cm, Ω) ≤0.5 JIS C5016 1994-7.1
Ho Khanyetso ha Lefatše, (Khauta e pentiloeng, φ 1.0mm, 3.0cm, Ω) 0.20 JIS C5016 1994-7.1
Matla a ho lokolla (N/cm) Maemo a Khoebo
Surface Insulation (mΩ) ≥200 Maemo a Khoebo
Adhesive Fastness(Teko ea lisele tse Lekholo) Ha ho sele e oang JIS C 6471 1995-8.1
Phatlalatso ea Soldering e sa Lefeng Pele (MAX 265℃) Ha ho stratification; Ha ho phophomang JIS C6471 1995-9.3
Solder (288 ℃, 10s, makhetlo a 3) Ha ho stratification; Ha ho phophomang JIS C6471 1995-9.3
Lelakabe le Retardant VTM-0 UL94
Sebopeho sa ho Hatisa PHASA JIS K5600

Recommended Processing Condition

Mokhoa oa Lamination Boemo ba lamination Boemo ba ho tiisa

Mocheso ()

Khatello(kg)

Nako (s)

Mocheso ()

Nako(mets)

Potlako- Lamination LKES800/6000:180±10LKES1000:175±5 100-120 80-120 160±10 30-60

Tlhokomeliso: Moreki a ka fetola theknoloji ho latela maemo a nnete ha a sebetsa.
(1) Hlakola lera la tšireletso pele, ebe u tlama FPC, 80 ℃ Tafole ea ho futhumatsa e ka sebelisoa bakeng sa ho kopanya pele.
(2) Laminate ho ea ka ts'ebetso e ka holimo, tlosa, ebe u ebola filimi e tsamaisang ka mor'a ho pholile.
(3) Ts'ebetso ea ho tiisa.

Ho paka

(1) Tlhaloso e tloaelehileng ea sehlahisoa: 250mm×100m.
(2) Kamora ho tlosa motlakase o sa fetoheng, lihlahisoa li pakiloe ka pampiri ea foil ea aluminium hape li kenyelletsoa ho omisa ho eona.
(3) Ka ntle ho phuthetsoe ka mabokoseng a pampiri 'me ho tsitsitsoe ho netefatsa polokeho ea lihlahisoa nakong ea lipalangoang le ho sebetsana, le ho qoba tšenyo.

Polokelo le Tlhokomelo

(1) Boemo ba polokelo bo khothalelitsoeng
Mocheso: (0-10)℃; Mongobo: ka tlase ho 70% RH
(2) Tlhokomeliso
(2.1) Ka kopo u se ke ua bula sephutheloana se ka ntle 'me u leka-lekanya filimi e sireletsang mocheso oa kamore bakeng sa lihora tsa 6 pele u sebelisa ho fokotsa phello ea serame le phoka filiming e sireletsang.
(2.2) Etsa tlhahiso ea hore e sebelisoe kapele kamoo ho ka khonehang ka mor'a ho tsoa sebakeng se batang, haeba boleng bo fetoha tlas'a mocheso o tloaelehileng nako e telele.
(2.3) Sehlahisoa sena ha se hanyetsane le moemeli oa tiiso ea metsi le phallo, haeba u na le theknoloji e ka holimo ea ho sebetsa, ka kopo leka le ho netefatsa pele.
(2.4) Etsa tlhahiso ea ho lamination ka potlako, vacuum laminating e hloka ho hlahlojoa le ho netefatsoa.
(2.5) Nako ea netefatso ea boleng tlasa maemo a kaholimo ke likhoeli tse 6.


Litšoantšo tsa lintlha tsa sehlahisoa:

Theipi ea boleng bo holimo ea Emi Shielding - Filimi ea EMI Shielding e nang le Tšireletso e Ntle - Lifoto tsa Lehlohonolo la Innovative

Theipi ea boleng bo holimo ea Emi Shielding - Filimi ea EMI Shielding e nang le Tšireletso e Ntle - Lifoto tsa Lehlohonolo la Innovative

Theipi ea boleng bo holimo ea Emi Shielding - Filimi ea EMI Shielding e nang le Tšireletso e Ntle - Lifoto tsa Lehlohonolo la Innovative

Theipi ea boleng bo holimo ea Emi Shielding - Filimi ea EMI Shielding e nang le Tšireletso e Ntle - Lifoto tsa Lehlohonolo la Innovative

Theipi ea boleng bo holimo ea Emi Shielding - Filimi ea EMI Shielding e nang le Tšireletso e Ntle - Lifoto tsa Lehlohonolo la Innovative

Theipi ea boleng bo holimo ea Emi Shielding - Filimi ea EMI Shielding e nang le Tšireletso e Ntle - Lifoto tsa Lehlohonolo la Innovative


Tataiso e Amanang ea Sehlahisoa:

Hangata re lumela hore sebopeho sa motho se etsa qeto ea boleng bo phahameng ba lihlahisoa, lintlha li etsa qeto ea hore lihlahisoa ke tsa boleng bo holimo, ka moea oa basebetsi ba SEBELE, BA SEBELISANG LE HO HLAHALA KA HO FETISISA bakeng sa High Quality Emi Shielding Tape - EMI Shielding Film with Good Shielding - Lucky Innovative , Sehlahisoa se tla fana ka lefats'e ka bophara, joalo ka: Bhutan, Lahore bakeng sa ho fana ka litšebeletso tsa bohlokoa ho bareki ba rona. likamano tsa nako e telele. Ho ba teng ha rona khafetsa ha lihlahisoa tsa boemo bo holimo hammoho le ts'ebeletso ea rona e ntle ea pele ho thekiso le ka mor'a thekiso ho netefatsa tlholisano e matla 'marakeng o ntseng o eketseha oa lefatše. Re ikemiselitse ho sebelisana le metsoalle ea khoebo e tsoang lapeng le kantle ho naha le ho theha bokamoso bo botle hammoho.
  • Motsamaisi oa k'hamphani o na le boiphihlelo bo matla haholo ba taolo le maikutlo a tiileng, basebetsi ba thekiso ba mofuthu ebile ba thabile, basebetsi ba tekheniki ke profeshenale ebile ba na le boikarabelo, kahoo ha re tšoenyehe ka sehlahisoa, moetsi ea motle.
    5 LinaleliKa Mignon ho tsoa Serbia - 2017.02.28 14:19
    Khamphani ena e lumellana le tlhokahalo ea 'maraka' me e kenela tlholisano ea 'maraka ka sehlahisoa sa eona sa boleng bo holimo, ke khoebo e nang le moea oa Sechaena.
    5 LinaleliKa Sandy oa Korea - 2017.03.08 14:45
    Ngola molaetsa wa hao mona mme o re romele wona