Filimi e rekisoang e chesang ea Emi Thermoplastic Shielding - Filimi ea EMI Shielding e nang le Tšireletso e Ntle - Lucky Innovative
Filimi e rekisoang e chesang ea Emi Thermoplastic Shielding - Filimi ea EMI Shielding e nang le Tšireletso e Ntle - Lucky Innovative
Filimi e rekisoang e chesang ea Emi Thermoplastic Shielding - Filimi ea EMI Shielding e nang le Tšireletso e Ntle - Lintlha tse ncha tsa Lehlohonolo:
Tlhaloso ea Sehlahisoa
EMI Shielding Film e sebelisoa haholo ho FPC e nang le li-Modules tsa mehala ea cellular, PC, lisebelisoa tsa bongaka, lik'hamera tsa dijithale, lisebelisoa tsa likoloi, jj.
Ho fumaneha ha Sehlahisoa
LKES-800
LKES-1000
LEKS-6000
Likarolo tsa Sehlahisoa
(1) Litšobotsi tse ntle tsa ho sebetsa
(2) Ts'ebetso e ntle ea motlakase
(3) Lintho tse ntle tsa tšireletso
(4) Ho hanyetsa mocheso o motle
(5) E na le botsoalle ba tikoloho (Halogen mahala, e fihlela litlhoko tsa RoHS Directives le REACH, joalo-joalo)
Sebopeho sa Sehlahisoa
Litšobotsi tsa Sehlahisoa
LKES -800
| Ntho | Lintlha tsa Tlhahlobo | Teko e tloaelehileng kapa mokhoa oa Teko |
| Botenya (Pele Lamination, μm) | 16±10% | Maemo a Khoebo |
| Botenya (Kamora Lamination, μm) | 13±10% | Maemo a Khoebo |
| Ho Khanyetso ha Lefatše(Khauta e pentiloeng, φ 1.0mm, 1.0cm, Ω) | JIS C5016 1994-7.1 | |
| Matla a ho ebola a filimi e matlafalitsoeng (N/25mm) | Maemo a Khoebo | |
| Phatlalatso ea Soldering e sa Lefeng Pele (MAX 265℃) | Ha ho stratification; Ha ho phophomang | JIS C6471 1995-9.3 |
| Solder (288 ℃, 10s, makhetlo a 3) | Ha ho stratification; Ha ho phophomang | JIS C6471 1995-9.3 |
| Shielding Properties(dB) | >50 | GB/T 30142-2013 |
| Ho hanyetsana le Bokaholimo (mΩ/ □) | 350 | Mekhoa e Mene ea Terminal |
| Lelakabe le Retardant | VTM-0 | UL94 |
| Sebopeho sa ho Hatisa | PHASA | JIS K5600 |
| Ho benya(60°, Gs) | ＜20 | GB9754-88 |
| Ho hanyetsa lik'hemik'hale (Acid, alkali le OSP) | PHASA | JIS C6471 1995-9.2 |
| Ho khomarela ho Stiffener (N/cm) | ＞4 | IPC-TM-650 2.4.9 |
LKES-1000
| Ntho | Lintlha tsa Tlhahlobo | Teko e tloaelehileng kapa mokhoa oa Teko |
| Botenya (Kamora Lamination, μm) | 14-18 | Maemo a Khoebo |
| Shielding Properties(dB) | ≥50 | GB/T 30142-2013 |
| Insulation ea holim'a metsi | ≥200 | Maemo a Khoebo |
| Adhesive Fastness (Teko ea lisele tse Lekholo) | Ha ho sele e oang | JIS C 6471 1995-8.1 |
| Ho hanyetsa Joala ho Hlakola | 50 Times ha ho na tšenyo | Maemo a Khoebo |
| Khanyetso ea Scratch | Ka makhetlo a 5 ha ho Leakage ea tšepe | Maemo a Khoebo |
| Ho hanyetsana le fatše, (Ho pola ka khauta, φ 1.0mm, 1.0cm, Ω) | ≤1.0 | JIS C5016 1994-7.1 |
| Phatlalatso ea Soldering e sa Lefeng Pele (MAX 265℃) | Ha ho stratification; Ha ho phophomang | JIS C6471 1995-9.3 |
| Solder (288 ℃, 10s, makhetlo a 3) | Ha ho stratification; Ha ho phophomang | JIS C6471 1995-9.3 |
| Sebopeho sa ho Hatisa | PHASA | JIS K5600 |
LKES-6000
| Ntho | Lintlha tsa Tlhahlobo | Teko e tloaelehileng kapa mokhoa oa Teko |
| Botenya (Kamora Lamination, μm) | 13±10% | Maemo a Khoebo |
| Shielding Properties(dB) | ≥50 | GB/T 30142-2013 |
| Ho Khanyetso ha Lefatše, (Khauta e pentiloeng, φ 1.0mm, 1.0cm, Ω) | ≤0.5 | JIS C5016 1994-7.1 |
| Ho Khanyetso ha Lefatše, (Khauta e pentiloeng, φ 1.0mm, 3.0cm, Ω) | 0.20 | JIS C5016 1994-7.1 |
| Matla a ho lokolla (N/cm) | Maemo a Khoebo | |
| Surface Insulation (mΩ) | ≥200 | Maemo a Khoebo |
| Adhesive Fastness(Teko ea lisele tse Lekholo) | Ha ho sele e oang | JIS C 6471 1995-8.1 |
| Phatlalatso ea Soldering e sa Lefeng Pele (MAX 265℃) | Ha ho stratification; Ha ho phophomang | JIS C6471 1995-9.3 |
| Solder (288 ℃, 10s, makhetlo a 3) | Ha ho stratification; Ha ho phophomang | JIS C6471 1995-9.3 |
| Lelakabe le Retardant | VTM-0 | UL94 |
| Sebopeho sa ho Hatisa | PHASA | JIS K5600 |
Recommended Processing Condition
| Mokhoa oa Lamination | Boemo ba lamination | Boemo ba ho tiisa | |||
| Mocheso (℃) | Khatello(kg) | Nako (s) | Mocheso (℃) | Nako(mets) | |
| Potlako- Lamination | LKES800/6000:180±10LKES1000:175±5 | 100-120 | 80-120 | 160±10 | 30-60 |
Tlhokomeliso: Moreki a ka fetola theknoloji ho latela maemo a nnete ha a sebetsa.
(1) Hlakola lera la tšireletso pele, ebe u tlama FPC, 80 ℃ Tafole ea ho futhumatsa e ka sebelisoa bakeng sa ho kopanya pele.
(2) Laminate ho ea ka ts'ebetso e ka holimo, tlosa, ebe u ebola filimi e tsamaisang ka mor'a ho pholile.
(3) Ts'ebetso ea ho tiisa.
Ho paka
(1) Tlhaloso e tloaelehileng ea sehlahisoa: 250mm×100m.
(2) Kamora ho tlosa motlakase o sa fetoheng, lihlahisoa li pakiloe ka pampiri ea foil ea aluminium hape li kenyelletsoa ho omisa ho eona.
(3) Ka ntle ho phuthetsoe ka mabokoseng a pampiri 'me ho tsitsitsoe ho netefatsa polokeho ea lihlahisoa nakong ea lipalangoang le ho sebetsana, le ho qoba tšenyo.
Polokelo le Tlhokomelo
(1) Boemo ba polokelo bo khothalelitsoeng
Mocheso: (0-10)℃; Mongobo: ka tlase ho 70% RH
(2) Tlhokomeliso
(2.1) Ka kopo u se ke ua bula sephutheloana se ka ntle 'me u leka-lekanya filimi e sireletsang mocheso oa kamore bakeng sa lihora tsa 6 pele u sebelisa ho fokotsa phello ea serame le phoka filiming e sireletsang.
(2.2) Etsa tlhahiso ea hore e sebelisoe kapele kamoo ho ka khonehang ka mor'a ho tsoa sebakeng se batang, haeba boleng bo fetoha tlas'a mocheso o tloaelehileng nako e telele.
(2.3) Sehlahisoa sena ha se hanyetsane le moemeli oa tiiso ea metsi le phallo, haeba u na le theknoloji e ka holimo ea ho sebetsa, ka kopo leka le ho netefatsa pele.
(2.4) Etsa tlhahiso ea ho lamination ka potlako, vacuum laminating e hloka ho hlahlojoa le ho netefatsoa.
(2.5) Nako ea netefatso ea boleng tlasa maemo a kaholimo ke likhoeli tse 6.
Litšoantšo tsa lintlha tsa sehlahisoa:
Tataiso e Amanang ea Sehlahisoa:
Re ikemiselitse ho fana ka tšehetso e bonolo, e bolokang nako le ea ho boloka chelete hang-hang bakeng sa ho rekisa filimi ea Emi Thermoplastic Shielding - EMI Shielding Film with Good Shielding - Lucky Innovative , Sehlahisoa se tla fana ka lefats'e ka bophara, joalo ka: Gambia , Hanover , Chile , Sehlopha sa rona sa litsebi se tla lula se le teng bakeng sa ho fana ka maikutlo. Re boetse re khona ho u fa lisampole tsa mahala ho fihlela litlhoko tsa hau. Ho tla etsoa boiteko bo matla ho u fa litšebeletso le thepa e nepahetseng. Bakeng sa mang kapa mang ea nahanang ka k'hamphani le thepa ea rona, ka kopo ikopanye le rona ka ho re romella mangolo-tsoibila kapa ho ikopanya le rona kapele. E le mokhoa oa ho tseba thepa ea rona le e tiileng. tse ling tse ngata, u ka tla fekthering ea rona ho tla tseba. Re tla lula re amohela baeti ba tsoang lefats'eng lohle ho tla khoebong ea rona ho theha likamano tsa khampani le rona. Ka kopo, ikutloe u lokolohile ho ikopanya le rona bakeng sa khoebo mme re lumela hore re tla arolelana boiphihlelo bo holimo ba khoebo le barekisi bohle ba rona.
Ka Adela ho tloha Munich - 2018.07.27 12:26 Ke tšepa hore k'hamphani e ka khomarela moea oa khoebo oa "Boleng, Bokhoni, Boqapi le Botšepehi", e tla ba betere hape e be betere nakong e tlang.
Ka Rita oa Cyprase - 2017.05.02 18:28 -
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