Lenane la Litheko bakeng sa Theipi e Sireletsang Foil - Filimi ea EMI Shielding e nang le Tšireletso e Ntle - Lehlohonolo la Innovative
Lenane la Litheko bakeng sa Theipi e Sireletsang Foil - Filimi ea EMI Shielding e nang le Tšireletso e Ntle - Lehlohonolo la Innovative
Lethathamo la Litheko bakeng sa Theipi e Sireletsang Foil - Filimi e Shielding ea EMI e nang le Tšireletso e Ntle - Lintlha tse ncha tsa Lehlohonolo:
Tlhaloso ea Sehlahisoa
EMI Shielding Film e sebelisoa haholo ho FPC e nang le li-Modules tsa mehala ea cellular, PC, lisebelisoa tsa bongaka, lik'hamera tsa dijithale, lisebelisoa tsa likoloi, jj.
Ho fumaneha ha Sehlahisoa
LKES-800
LKES-1000
LEKS-6000
Likarolo tsa Sehlahisoa
(1) Litšobotsi tse ntle tsa ho sebetsa
(2) Ts'ebetso e ntle ea motlakase
(3) Lintho tse ntle tsa tšireletso
(4) Ho hanyetsa mocheso o motle
(5) E na le botsoalle ba tikoloho (Halogen mahala, e fihlela litlhoko tsa RoHS Directives le REACH, joalo-joalo)
Sebopeho sa Sehlahisoa
Litšobotsi tsa Sehlahisoa
LKES -800
| Ntho | Lintlha tsa Tlhahlobo | Teko e tloaelehileng kapa mokhoa oa Teko |
| Botenya (Pele Lamination, μm) | 16±10% | Maemo a Khoebo |
| Botenya (Kamora Lamination, μm) | 13±10% | Maemo a Khoebo |
| Ho Khanyetso ha Lefatše(Khauta e pentiloeng, φ 1.0mm, 1.0cm, Ω) | JIS C5016 1994-7.1 | |
| Matla a ho ebola a filimi e matlafalitsoeng (N/25mm) | Maemo a Khoebo | |
| Phatlalatso ea Soldering e sa Lefeng Pele (MAX 265℃) | Ha ho stratification; Ha ho phophomang | JIS C6471 1995-9.3 |
| Solder (288 ℃, 10s, makhetlo a 3) | Ha ho stratification; Ha ho phophomang | JIS C6471 1995-9.3 |
| Shielding Properties(dB) | >50 | GB/T 30142-2013 |
| Ho hanyetsana le Bokaholimo (mΩ/ □) | 350 | Mekhoa e Mene ea Terminal |
| Lelakabe le Retardant | VTM-0 | UL94 |
| Sebopeho sa ho Hatisa | PHASA | JIS K5600 |
| Ho benya(60°, Gs) | ＜20 | GB9754-88 |
| Ho hanyetsa lik'hemik'hale (Acid, alkali le OSP) | PHASA | JIS C6471 1995-9.2 |
| Ho khomarela ho Stiffener (N/cm) | ＞4 | IPC-TM-650 2.4.9 |
LKES-1000
| Ntho | Lintlha tsa Tlhahlobo | Teko e tloaelehileng kapa mokhoa oa Teko |
| Botenya (Kamora Lamination, μm) | 14-18 | Maemo a Khoebo |
| Shielding Properties(dB) | ≥50 | GB/T 30142-2013 |
| Insulation ea holim'a metsi | ≥200 | Maemo a Khoebo |
| Adhesive Fastness (Teko ea lisele tse Lekholo) | Ha ho sele e oang | JIS C 6471 1995-8.1 |
| Ho hanyetsa Joala ho Hlakola | 50 Times ha ho na tšenyo | Maemo a Khoebo |
| Khanyetso ea Scratch | Ka makhetlo a 5 ha ho Leakage ea tšepe | Maemo a Khoebo |
| Ho hanyetsana le fatše, (Ho pola ka khauta, φ 1.0mm, 1.0cm, Ω) | ≤1.0 | JIS C5016 1994-7.1 |
| Phatlalatso ea Soldering e sa Lefeng Pele (MAX 265℃) | Ha ho stratification; Ha ho phophomang | JIS C6471 1995-9.3 |
| Solder (288 ℃, 10s, makhetlo a 3) | Ha ho stratification; Ha ho phophomang | JIS C6471 1995-9.3 |
| Sebopeho sa ho Hatisa | PHASA | JIS K5600 |
LKES-6000
| Ntho | Lintlha tsa Tlhahlobo | Teko e tloaelehileng kapa mokhoa oa Teko |
| Botenya (Kamora Lamination, μm) | 13±10% | Maemo a Khoebo |
| Shielding Properties(dB) | ≥50 | GB/T 30142-2013 |
| Ho Khanyetso ha Lefatše, (Khauta e pentiloeng, φ 1.0mm, 1.0cm, Ω) | ≤0.5 | JIS C5016 1994-7.1 |
| Ho Khanyetso ha Lefatše, (Khauta e pentiloeng, φ 1.0mm, 3.0cm, Ω) | 0.20 | JIS C5016 1994-7.1 |
| Matla a ho lokolla (N/cm) | Maemo a Khoebo | |
| Surface Insulation (mΩ) | ≥200 | Maemo a Khoebo |
| Adhesive Fastness(Teko ea lisele tse Lekholo) | Ha ho sele e oang | JIS C 6471 1995-8.1 |
| Phatlalatso ea Soldering e sa Lefeng Pele (MAX 265℃) | Ha ho stratification; Ha ho phophomang | JIS C6471 1995-9.3 |
| Solder (288 ℃, 10s, makhetlo a 3) | Ha ho stratification; Ha ho phophomang | JIS C6471 1995-9.3 |
| Lelakabe le Retardant | VTM-0 | UL94 |
| Sebopeho sa ho Hatisa | PHASA | JIS K5600 |
Recommended Processing Condition
| Mokhoa oa Lamination | Boemo ba lamination | Boemo ba ho tiisa | |||
| Mocheso (℃) | Khatello(kg) | Nako (s) | Mocheso (℃) | Nako(mets) | |
| Potlako- Lamination | LKES800/6000:180±10LKES1000:175±5 | 100-120 | 80-120 | 160±10 | 30-60 |
Tlhokomeliso: Moreki a ka fetola theknoloji ho latela maemo a nnete ha a sebetsa.
(1) Hlakola lera la tšireletso pele, ebe u tlama FPC, 80 ℃ Tafole ea ho futhumatsa e ka sebelisoa bakeng sa ho kopanya pele.
(2) Laminate ho ea ka ts'ebetso e ka holimo, tlosa, ebe u ebola filimi e tsamaisang ka mor'a ho pholile.
(3) Ts'ebetso ea ho tiisa.
Ho paka
(1) Tlhaloso e tloaelehileng ea sehlahisoa: 250mm×100m.
(2) Kamora ho tlosa motlakase o sa fetoheng, lihlahisoa li pakiloe ka pampiri ea foil ea aluminium hape li kenyelletsoa ho omisa ho eona.
(3) Ka ntle ho phuthetsoe ka mabokoseng a pampiri 'me ho tsitsitsoe ho netefatsa polokeho ea lihlahisoa nakong ea lipalangoang le ho sebetsana, le ho qoba tšenyo.
Polokelo le Tlhokomelo
(1) Boemo ba polokelo bo khothalelitsoeng
Mocheso: (0-10)℃; Mongobo: ka tlase ho 70% RH
(2) Tlhokomeliso
(2.1) Ka kopo u se ke ua bula sephutheloana se ka ntle 'me u leka-lekanya filimi e sireletsang mocheso oa kamore bakeng sa lihora tsa 6 pele u sebelisa ho fokotsa phello ea serame le phoka filiming e sireletsang.
(2.2) Etsa tlhahiso ea hore e sebelisoe kapele kamoo ho ka khonehang ka mor'a ho tsoa sebakeng se batang, haeba boleng bo fetoha tlas'a mocheso o tloaelehileng nako e telele.
(2.3) Sehlahisoa sena ha se hanyetsane le moemeli oa tiiso ea metsi le phallo, haeba u na le theknoloji e ka holimo ea ho sebetsa, ka kopo leka le ho netefatsa pele.
(2.4) Etsa tlhahiso ea ho lamination ka potlako, vacuum laminating e hloka ho hlahlojoa le ho netefatsoa.
(2.5) Nako ea netefatso ea boleng tlasa maemo a kaholimo ke likhoeli tse 6.
Litšoantšo tsa lintlha tsa sehlahisoa:
Tataiso e Amanang ea Sehlahisoa:
Re tsitlallela molao-motheo oa nts'etsopele ea 'Boleng bo phahameng, Bokhabane, Botšepehi le mokhoa oa ho sebetsa oa fatše' ho u fa tšebeletso e babatsehang ea ho sebetsana le PriceList bakeng sa Foil Shielding Tape - EMI Shielding Film e nang le Good Shielding - Lucky Innovative , Sehlahisoa se tla fana ka lefats'e lohle, joalo ka: Moscow, Nepal, Turin, le marako a rona a ka tšeptjoang kajeno a tla theha marako a rona. Ke rona feela ba nang le boleng bo betere le bo betere, re ka fihlelang bareki ba rona le rona ka borona. Amohela bareki hohle ka lentsoe ho ikopanya le rona bakeng sa ho fumana khoebo e eketsehileng le likamano tse tšepahalang. Re lula re le mona ho sebeletsa litlhoko tsa hau neng kapa neng ha u hloka.
Ka Sarah oa Lesotho - 2017.07.07 13:00 Re metsoalle ea khale, boleng ba sehlahisoa sa k'hamphani esale bo le botle haholo 'me lekhetlong lena theko le eona e theko e tlase haholo.
Ka Rita ho tloha Amsterdam - 2018.03.03 13:09 -
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