EMI Shielding Film e nang le Tšireletso e Ntle
EMI Shielding Film e nang le Tšireletso e Ntle
Tlhaloso ea Sehlahisoa
EMI Shielding Film e sebelisoa haholo ho FPC e nang le li-Modules tsa mehala ea cellular, PC, lisebelisoa tsa bongaka, lik'hamera tsa dijithale, lisebelisoa tsa likoloi, jj.
Ho fumaneha ha Sehlahisoa
LKES-800
LKES-1000
LEKS-6000
Likarolo tsa Sehlahisoa
(1) Litšobotsi tse ntle tsa ho sebetsa
(2) Ts'ebetso e ntle ea motlakase
(3) Lintho tse ntle tsa tšireletso
(4) Ho hanyetsa mocheso o motle
(5) E na le botsoalle ba tikoloho (Halogen mahala, e fihlela litlhoko tsa RoHS Directives le REACH, joalo-joalo)
Sebopeho sa Sehlahisoa
Litšobotsi tsa Sehlahisoa
LKES -800
| Ntho | Lintlha tsa Tlhahlobo | Teko e tloaelehileng kapa mokhoa oa Teko |
| Botenya (Pele Lamination),mm) | 16±10% | Maemo a Khoebo |
| Botenya (Kamora Lamination,mm) | 13±10% | Maemo a Khoebo |
| Khanyetso ea fatše(Khauta e pentiloeng,Phi1.0mm, 1.0cm,Oh) | HE C5016 1994-7.1 | |
| Matla a ho ebola a filimi e matlafalitsoeng (N/25mm) | Maemo a Khoebo | |
| Reflow ea Soldering e sa Lebelloang (MAX 265℃) | Ha ho stratification; Ha ho phophomang | HE C6471 1995-9.3 |
| Solder (288℃, 10s, makhetlo a 3) | Ha ho stratification; Ha ho phophomang | HE C6471 1995-9.3 |
| Shielding Properties(dB) | >50 | GB/T 30142-2013 |
| Bokaholimo ba Resistance(mOh/□) | ＜350 | Mekhoa e Mene ea Terminal |
| Lelakabe le Retardant | VTM-0 | UL94 |
| Sebopeho sa ho Hatisa | PHASA | JIS K5600 |
| Ho benya(60°, Gs) | ＜20 | GB9754-88 |
| Ho hanyetsa lik'hemik'hale(Asiti, alkali le OSP) | PHASA | HE C6471 1995-9.2 |
| Ho khomarela ho Stiffener (N/cm) | ＞4 | IPC-TM-650 2.4.9 |
LKES-1000
| Ntho | Lintlha tsa Tlhahlobo | Teko e tloaelehileng kapa mokhoa oa Teko |
| Botenya (Kamora Lamination,mm) | 14-18 | Maemo a Khoebo |
| Shielding Properties(dB) | ≥50 | GB/T 30142-2013 |
| Insulation ea holim'a metsi | ≥200 | Maemo a Khoebo |
| Adhesive Fastness(Teko ea lisele tse Lekholo) | Ha ho sele e oang | JIS C 6471 1995-8.1 |
| Ho hanyetsa Joala ho Hlakola | 50 Times ha ho na tšenyo | Maemo a Khoebo |
| Khanyetso ea Scratch | Ka makhetlo a 5 ha ho Leakage ea tšepe | Maemo a Khoebo |
| Ground Resistance, (Ho roala khauta,Phi1.0mm, 1.0cm,Oh) | ≤1.0 | HE C5016 1994-7.1 |
| Reflow ea Soldering e sa Lebelloang (MAX 265℃) | Ha ho stratification; Ha ho phophomang | HE C6471 1995-9.3 |
| Solder (288℃, 10s, makhetlo a 3) | Ha ho stratification; Ha ho phophomang | HE C6471 1995-9.3 |
| Sebopeho sa ho Hatisa | PHASA | JIS K5600 |
LKES-6000
| Ntho | Lintlha tsa Tlhahlobo | Teko e tloaelehileng kapa mokhoa oa Teko |
| Botenya (Kamora Lamination,mm) | 13±10% | Maemo a Khoebo |
| Shielding Properties(dB) | ≥50 | GB/T 30142-2013 |
| Ground Resistance, (Gold plated,Phi1.0mm, 1.0cm,Oh) | ≤0.5 | HE C5016 1994-7.1 |
| Ground Resistance, (Gold plated,Phi1.0mm, 3.0cm,Oh) | 0.20 | HE C5016 1994-7.1 |
| Matla a ho lokolla (N/cm) | Maemo a Khoebo | |
| Insulation ea holim'a metsi(mOh) | ≥200 | Maemo a Khoebo |
| Adhesive Fastness(Teko ea lisele tse Lekholo) | Ha ho sele e oang | JIS C 6471 1995-8.1 |
| Reflow ea Soldering e sa Lebelloang (MAX 265℃) | Ha ho stratification; Ha ho phophomang | HE C6471 1995-9.3 |
| Solder (288℃, 10s, makhetlo a 3) | Ha ho stratification; Ha ho phophomang | HE C6471 1995-9.3 |
| Lelakabe le Retardant | VTM-0 | UL94 |
| Sebopeho sa ho Hatisa | PHASA | JIS K5600 |
Recommended Processing Condition
| Mokhoa oa Lamination | Boemo ba lamination | Boemo ba ho tiisa | |||
| Mocheso (℃) | Khatello(kg) | Nako (s) | Mocheso (℃) | hora(mets) | |
| Potlako- Lamination | LKES800/6000:180±10LKES1000:175±5 | 100-120 | 80-120 | 160±10 | 30-60 |
Tlhokomeliso: Moreki a ka fetola theknoloji ho latela maemo a nnete ha a sebetsa.
(1)Ebola lera la tšireletso pele, ebe u tlama ho FPC, 80℃Tafole ea ho futhumatsa e ka sebelisoa bakeng sa ho kopanya pele.
(2)Laminate ho ea ka ts'ebetso e ka holimo, tlosa, ebe u ebola filimi ea sephethephethe ka mor'a ho pholile.
(3)Mokhoa oa ho tiisa.
Ho paka
(1) Tlhaloso e tloaelehileng ea sehlahisoa: 250mm×100m.
(2) Kamora ho tlosa motlakase o sa fetoheng, lihlahisoa li pakiloe ka pampiri ea foil ea aluminium hape li kenyelletsoa ho omisa ho eona.
(3) Ka ntle ho phuthetsoe ka mabokoseng a pampiri 'me ho tsitsitsoe ho netefatsa polokeho ea lihlahisoa nakong ea lipalangoang le ho sebetsana, le ho qoba tšenyo.
Polokelo le Tlhokomelo
(1) Boemo ba polokelo bo khothalelitsoeng
Mocheso: (0-10)℃; Mongobo: ka tlase ho 70% RH
(2) Tlhokomeliso
(2.1) Ka kopo u se ke ua bula sephutheloana se ka ntle 'me u leka-lekanya filimi e sireletsang mocheso oa kamore bakeng sa lihora tsa 6 pele u sebelisa ho fokotsa phello ea serame le phoka filiming e sireletsang.
(2.2) Etsa tlhahiso ea hore e sebelisoe kapele kamoo ho ka khonehang ka mor'a ho tsoa sebakeng se batang, haeba boleng bo fetoha tlas'a mocheso o tloaelehileng nako e telele.
(2.3) Sehlahisoa sena ha se hanyetsane le moemeli oa tiiso ea metsi le phallo, haeba u na le theknoloji e ka holimo ea ho sebetsa, ka kopo leka le ho netefatsa pele.
(2.4) Etsa tlhahiso ea ho lamination ka potlako, vacuum laminating e hloka ho hlahlojoa le ho netefatsoa.
(2.5) Nako ea netefatso ea boleng tlasa maemo a kaholimo ke likhoeli tse 6.